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苏州通富超威半导体有限公司(TF-AMD)简介
1、超威半导体(AMD)简介:
AMD公司成立于1969 年,总部位于美国加利福尼亚州桑尼维尔。AMD(NYSE: AMD)是一家创新的科技公司,致力于与客户及合作伙伴紧密合作,开发下一代面向商用、家用和游戏领域的计算和图形处理解决方案。.AMD的业务遍布全球,拥有约为12000名员工。
2、通富微电子股份有限公司简介:
1997年10月成立,股票简称:通富微电,股票代码:002156。
公司总部位于中国江苏省南通市,旗下企业包括通富微电、南通通富、通富通科、合肥通富、厦门通富,通富超威(苏州)和通富超威(槟城)等七大封测企业。公司是中国本土前三大集成电路封装测试企业,全球前十大半导体制造商一半以上是通富微电的客户。公司拥有国家认定企业技术中心、国家博士后科研工作站、江苏省企业院士工作站、省级工程技术研究中心和企业研究院等高层次研发平台。
3、苏州通富超威半导体有限公司(TF-AMD)
公司位于中国苏州工业园区苏桐路88号,由通富微电子股份有限公司(通富微电)作为控股股东与美国超威半导体(AMD)共同合资成立。公司主要从事高端处理器芯片封装测试业务,满足从晶圆级测试、晶圆切割、封装、测试、打标的五大 CPU 后期制造流程,同时具备对中央处理器(CPU)、图形处理器(GPU)以及加速处理器(APU)进行封装和测试的能力。公司拥有多项专利技术,在封装测试领域不断进行技术创新和研发。
诚挚邀请您加盟本公司,我们坚信能为员工提供具有竞争力的薪酬/福利和系统的培训机会(海外/本地),以及广阔的职业发展前景。

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Information is aggregated from the web and may not be exact. For reference only.
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How Fast Is Hiring Growing? (117 open positions)

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Note: How fast is hiring at 苏州通富超威半导体有限公司 growing? 2026: 79 openings (up 55%), 2025: 51 openings (down 29%), 2024: 72 openings (down 15%), 2023: 85 openings (down 2%), 2022: 87 openings (up 521%), 2021: 14 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

Master's Degree Job Demand Analysis

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Growth Rate
2026 vs 2025
  • 2025: Flat 0%-
  • 2024: Down 80%
  • 2023: Up 900%
  • 2022: Flat 0%-
Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 苏州通富超威半导体有限公司 growing? Master's recruitment over the years: 2025: 2 openings (flat), 2024: 2 openings (down 80%), 2023: 10 openings (up 900%), 2022: 1 openings (flat), 2021: 1 openings.

R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 苏州通富超威半导体有限公司? Based on an analysis of 's job postings over the past year, "电子/电器/通信技术类" demand: 19.6%, "计算机/网络/技术类": 16.1%, "机械/仪器仪表类": 13.1%, "其他(研发和技术类)": 9.5%, "电气/能源/动力类": 4.2%, "美术/设计/创意类": 1.2%. For reference only.

— What Are the Salaries Like? (168 records)

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salary range: 4.5K - 50K, 70.3% of roles pay ¥8-15K
Note: salary statistics are based on 168 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 苏州通富超威半导体有限公司?70.3% of positions earn 8-15K, Fresh graduate salary: ¥9.3K。工厂生产类 average salary ¥10.9K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

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Are salaries high at 苏州通富超威半导体有限公司? We provide: ee,设备工,pr,oc,工艺工程,设备技术,ie,开发工程师,质量,工业工程,测试工程,ma,te,生产计划,研发工程师,pe,工艺技术,施工,pi,人事. Click to view detailed salary analysis by job.

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Job Category

  • 工厂生产类
    36.9% of total 36.9%
  • 质量管理类
    20.8% of total 20.8%
  • 电子/电器/通信技术类
    19.6% of total 19.6%
  • 技工类
    19% of total 19%

Education

  • 本科
    70.2% of total 70.2%
  • 大专
    19.6% of total 19.6%
  • 硕士
    5.4% of total 5.4%
  • 高中
    3% of total 3%

Experience

  • 不限
    30.4% of total 30.4%
  • 1-3年
    19% of total 19%
  • 应届生
    17.9% of total 17.9%
  • 5-10年
    17.3% of total 17.3%
View Detailed Analysis

What does 苏州通富超威半导体有限公司 require? Who is 苏州通富超威半导体有限公司 hiring? recruitment: 工厂生产类占比最多占36.9%,其次是质量管理类占20.8%. What education can get in at ? 本科占比最多占70.2%,其次是大专占19.6%. High education required at ? 硕士占5.4%,博士占0.6%. Work experience required at ? 不限占比最多占30.4%,其次是1-3年占19%. Where are the job locations at ? 苏州占比最多占94.6%,其次是南通占5.4%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 13,338万(美元)
Legal Representative: 石磊
Date Established:
Credit Code: 91320594759661883L
Registered Address: 苏州工业园区苏桐路88号

Partners & Suppliers

通富微电为苏州通富超威提供技术、管理及部分封测产能支持 Source
供应商 芯片封测服务
苏州通富超威为AMD提供芯片封装与测试服务 Source
合作客户 芯片封测服务

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“致力于高速光通信测试、光芯片测试和半导体测试三大领域测试仪器和设备的开发。”
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“One-stop chip finished product manufacturing service”
“One of the semiconductor packaging and testing manufacturers”
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电子厂/电子 集成电路封装 半导体 半导体设计

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