Company Overview

Development Stage

About the Company

星科金朋公司是世界排名前列的半导体封装测试公司,提供全球各地客户整体与快捷的高质量服务。客户群包括数家晶圆代工厂、全球知名IDM大厂与遍布全球各地集成电路设计公司。服务产品种类含盖通信、电脑、电源供应器与数据型消费性产品等。以先进制造与管理技术为基础,加上全球性布局,星科金朋在全球封装测试业树立了可靠与高质量服务的标竿。星科金朋公司在全球拥有一万多名员工,在新加坡、中国及中国台湾地区、韩国、马来西亚和美国等地设有工厂。

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星科金朋半导体 How Fast Is Hiring Growing? (13 open positions)

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Note: How fast is hiring at 星科金朋半导体(江阴)有限公司 growing? 星科金朋半导体2026: 27 openings (down 40%), 2025: 45 openings (up 32%), 2024: 34 openings (up 55%), 2023: 22 openings (up 1000%), 2022: 2 openings (down 96%), 2021: 55 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

星科金朋半导体 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 星科金朋半导体(江阴)有限公司? Based on an analysis of 星科金朋半导体's job postings over the past year, "电子/电器/通信技术类" demand: 16.9%, "其他(研发和技术类)": 15.4%, "计算机/网络/技术类": 4.6%, "机械/仪器仪表类": 3.1%, "生物/制药/化工/环保类": 1.5%, "电气/能源/动力类": 1.5%. For reference only.

星科金朋半导体 — What Are the Salaries Like? (65 records)

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星科金朋半导体 Salary Overview
salary range: 4.5K - 20K, 72.3% of roles pay ¥8-15K
Note: salary statistics are based on 65 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 星科金朋半导体(江阴)有限公司?星科金朋半导体72.3% of positions earn 8-15K, Undergraduate salary: ¥。工厂生产类 average salary ¥9.5K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 星科金朋半导体

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Are salaries high at 星科金朋半导体(江阴)有限公司? We provide: pi,操作工,设备技术,工艺工程,ie,ir,qe,分析,切割,半导体技术,品管,管理工程师,维修技术员,设备工,软件工程,销售助理,项目管理,bp,hr,planner. Click to view detailed salary analysis by job.

星科金朋半导体 honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

星科金朋半导体 Related Industry Tags

Job Category

  • 工厂生产类
    32.3% of total 32.3%
  • 技工类
    21.5% of total 21.5%
  • 电子/电器/通信技术类
    16.9% of total 16.9%
  • 其他(研发和技术类)
    15.4% of total 15.4%

Education

  • 本科
    60% of total 60%
  • 大专
    29.2% of total 29.2%
  • 不限
    7.7% of total 7.7%
  • 高中
    3.1% of total 3.1%

Experience

  • 不限
    83.1% of total 83.1%
  • 1-3年
    7.7% of total 7.7%
  • 3-5年
    7.7% of total 7.7%
  • 5-10年
    1.5% of total 1.5%
View Detailed Analysis

What does 星科金朋半导体(江阴)有限公司 require? Who is 星科金朋半导体 hiring? 星科金朋半导体 recruitment: 工厂生产类占比最多占32.3%,其次是技工类占21.5%. What education can get in at 星科金朋半导体? 本科占比最多占60%,其次是大专占29.2%. Work experience required at 星科金朋半导体? 不限占比最多占83.1%,其次是1-3年占7.7%. Where are the job locations at 星科金朋半导体? 无锡占比最多占100%. Based on job postings from the past year, for reference only.

Company / Job Addresses

Business Registration

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Operating Status: 开业
Registered Capital: 32,500万(美元)
Legal Representative: 吴靖宇
Date Established:
Credit Code: 913202003414703854
Registered Address: 江阴高新技术产业开发区长山路78号

Partners & Suppliers

为英飞凌提供封装测试解决方案 Source
合作客户 半导体封测
为AMD提供先进封装测试服务 Source
合作客户 半导体封测
为恩智浦提供先进封装服务 Source
合作客户 半导体封测
为博通提供封装测试解决方案 Source
合作客户 半导体封测
为高通骁龙系列芯片提供先进封装测试服务 Source
合作客户 半导体封测

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星科金朋半导体 Competitors (Similar Companies)

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电子厂/电子 连接器 电子设备 生产
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电子厂/电子 半导体 液晶显示/LCD 通讯产品
木业 地板 实木门 楼梯
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制造 研发 定制 汽车质量
“Provides consulting and services to over one hundred pharmaceutical ma”
模具 注塑成型 塑胶模具 塑胶

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