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Company Overview

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About the Company

星科金朋公司是世界排名前列的半导体封装测试公司,提供全球各地客户整体与快捷的高质量服务。客户群包括数家晶圆代工厂、全球知名IDM大厂与遍布全球各地集成电路设计公司。服务产品种类含盖通信、电脑、电源供应器与数据型消费性产品等。以先进制造与管理技术为基础,加上全球性布局,星科金朋在全球封装测试业树立了可靠与高质量服务的标竿。星科金朋公司在全球拥有一万多名员工,在新加坡、中国及中国台湾地区、韩国、马来西亚和美国等地设有工厂。

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星科金朋半导体 How Fast Is Hiring Growing? (13 open positions)

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Growth Rate
2026 vs 2025
  • 2025: Up 32%
  • 2024: Up 55%
  • 2023: Up 1000%
  • 2022: Down 96%
星科金朋半导体 Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
Note: How fast is hiring at 星科金朋半导体(江阴)有限公司 growing? 星科金朋半导体2025年45个(增长32%),2024年34个(增长55%),2023年22个(增长1000%),2022年2个(下降96%),2021年55个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

星科金朋半导体 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 星科金朋半导体(江阴)有限公司? Based on an analysis of 星科金朋半导体's job postings over the past year, “电子/电器/通信技术类”需求占17.7%,“其他(研发和技术类)”占14.5%,“计算机/网络/技术类”占3.2%,“机械/仪器仪表类”占1.6%,“生物/制药/化工/环保类”占1.6%,“电气/能源/动力类”占1.6%. For reference only.

星科金朋半导体 — What Are the Salaries Like? (62 records)

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星科金朋半导体 Salary Overview
salary range: 4.5K - 20K, 72.6% of roles pay ¥8-15K
Note: salary statistics are based on 62 salary records from the past year and depend on the job sample. For reference only.
星科金朋半导体(江阴)有限公司工资待遇怎么样?星科金朋半导体72.6%的岗位拿8-15K,本科工资¥。与同行业比-42%,工厂生产类平均工资¥9.4K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 星科金朋半导体

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Are salaries high at 星科金朋半导体(江阴)有限公司? We provide: pi,操作工,设备技术,分析,ie,qe,切割,半导体技术,品管,工艺工程,管理工程师,维修技术员,销售助理,项目管理,bp,hr,ir,planner,ppc,test. Click to view detailed salary analysis by job.

星科金朋半导体 honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

星科金朋半导体 Related Industry Tags

Job Category

  • 工厂生产类
    32.3% of total 32.3%
  • 技工类
    21% of total 21%
  • 电子/电器/通信技术类
    17.7% of total 17.7%
  • 其他(研发和技术类)
    14.5% of total 14.5%

Education

  • 本科
    58.1% of total 58.1%
  • 大专
    30.6% of total 30.6%
  • 不限
    8.1% of total 8.1%
  • 高中
    3.2% of total 3.2%

Experience

  • 不限
    82.3% of total 82.3%
  • 1-3年
    8.1% of total 8.1%
  • 3-5年
    8.1% of total 8.1%
  • 5-10年
    1.6% of total 1.6%
View Detailed Analysis

What does 星科金朋半导体(江阴)有限公司 require? Who is 星科金朋半导体 hiring? 星科金朋半导体招聘类别工厂生产类占比最多占32.3%,其次是技工类占21%。星科金朋半导体什么学历能进?本科占比最多占58.1%,其次是大专占30.6%。工作经验星科金朋半导体有什么要求?不限占比最多占82.3%,其次是1-3年占8.1%。星科金朋半导体工作地区在哪?无锡占比最多占100%。 Based on job postings from the past year, for reference only.

Company / Job Addresses

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 32,500万(美元)
Legal Representative: 吴靖宇
Date Established:
Credit Code: 913202003414703854
Registered Address: 江阴高新技术产业开发区长山路78号

Partners & Suppliers

为英飞凌提供封装测试解决方案 Source
合作客户 半导体封测
为AMD提供先进封装测试服务 Source
合作客户 半导体封测
为恩智浦提供先进封装服务 Source
合作客户 半导体封测
为博通提供封装测试解决方案 Source
合作客户 半导体封测
为高通骁龙系列芯片提供先进封装测试服务 Source
合作客户 半导体封测

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星科金朋半导体 Competitors (Similar Companies)

“集成电路晶圆级先进封测企业”
“全方位的芯片成品制造一站式服务”
“公司产品聚焦于功率半导体、智能传感器领域,为客户提供系列化的半导体产品与服务。 ”
“产品为12英寸集成电路晶圆,应用于PC,Server,Graphic,Mobile,Graphic等”
半导体 芯片封装 半导体制造 图形处理器
“工业4.0智能工厂建设”
“功率及数模混合芯片设计”
连接器 电子设备 精密电子 电子连接器
“信号链芯片及其解决方案提供商”
电子厂/电子 微电子 集成电路封装测试 封装测试
“一家高科技集成电路芯片代工企业”
微电子 半导体 电子 电子技术
电子厂/电子 半导体 液晶显示 IC
电机 压缩机 制冷 流体机械
木业 地板 实木门 楼梯

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