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Company Overview

Development Stage

About the Company

深圳市邦大科技有限公司是一家提供电子新材料的研发、生产、销售与一体的高新技术企业,公司自2003年成立以来,一直致力于为客户提供更好的产品与解决方案。
公司拥有精锐的研发团队、完善的研发设施,研发生产与世界知名品牌同等品质的电子辅料产品,主要包括:SMT贴片红胶、导热硅脂、耐黄变环氧光学结构胶、底部填充胶、COB邦定黑胶、防水灌封胶、硅胶、无铅锡膏、无铅焊料、助焊剂、清洗剂等。
公司以先进的欧美技术和严格的质量管理引领行业潮流,每天我司产品为数以亿计的电子元器件提供粘接、焊锡服务,并安全流通于整个中国及欧美、东南亚等地区。
公司按照ISO9001:2008质量管理体系要求及ISO14001:2004环境管理体系要求,从原料检验、产品生产制程到出货检验都进行严格的控制,保证了产品的优异品质及卓越的稳定性。
公司的秉承的经营理念:做行业新标杆,与客户共享新成果。
邦大科技一直在追求卓越,创新精进!

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Operating Status: 开业
Registered Capital: 100万(元)
Legal Representative: 梁国辉
Date Established:
Credit Code: 91440300750493123Y
Registered Address: 深圳市龙华区观澜街道库坑社区库坑皇帝印工业区4号G栋201

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