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Company Overview

Development Stage

About the Company

江苏弘信华印是由厦门弘信(HON-Flex)和镇江华印(SHPC)合资成立,企业注册资本3500万人民币,投资总额8000万人民币;工厂面积:******平方米,刚挠结合板生产能力:5000平方米/月。新公司的组建结合了厦门弘信的资金、管理理念和镇江华印的技术经验。
弘信华印与日本SHARP签署技术合作协议,引进日本刚挠结合板先进生产和检测设备,致力于打造业界领先的刚挠结合板生产基地,专业研发生产高端多层刚挠结合印制电路板,目标10年内成为国内刚挠结合印制电路板生产的龙头企业。现许多岗位急需你的加盟。

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Business Registration

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Operating Status: 注销
Registered Capital: 13,000万(元)
Legal Representative: 丁澄
Date Established:
Credit Code: 91321100346165419R
Registered Address: 镇江市润州区南徐大道308号-1

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