科技(无锡)有限公司为德国公司在华的*家独资企业,由科技(中国)有限公司直接投资,总投资额为1.5亿美元,注册资本5000万美金,主要从事半导体后道封装和智能卡芯片封装。公司于1996年开始运作,目前拥有员工2000人左右。
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