Bond Laser R&D strength (tech talent demand and pay)
What is the demand for tech talent at Bond Laser? Based on job postings in the past year, “电子/电器/通信技术类”占14%，“计算机/网络/技术类”占7.6%，“机械/仪器仪表类”占6.1%，“其他（研发和技术类）”占5.7%，“电气/能源/动力类”占2.9%，“美术/设计/创意类”占1.6%，“生物/制药/化工/环保类”占1%，“咨询/顾问类”占0.2%，“医疗卫生/美容保健类”占0.2%. For reference only.
