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About the Company

泰成半导体精密(苏州)有限公司是中外合资企业。2004年创建于苏州工业园区 。我们专业从事半导体封装,分离及成型设备的零部件加工,主要客户为三星电子,凤凰,华润,航亚等大型半导体企业。公司拥有夏米尔放电,慢走丝,米克朗高速加工中心,瓦西诺光曲磨床,冈本,长岛等精密平面磨床等高端加工设备.2021年公司被评为高新技术企业。 因公司业务拓展需求,诚意邀请冲压模设计,注塑模编程,精密放电加工等有资历人员加入,公司随时恭候您登门或来电垂询。

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Recruitment Overview / Current Status (4 open positions)

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Business Registration

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Operating Status: 开业
Registered Capital: 76.25万(美元)
Legal Representative: 尹成锡
Date Established:
Credit Code: 913205947573296768
Registered Address: 苏州工业园娄葑北区扬东路58号E栋一楼

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半导体封装测试 封装测试 半导体封装 研发

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