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About the Company

[Summary] 智能终端控制芯片研发产业化

基合半导体主要致力于智能终端控制芯片研发产业化,以触摸屏控制、摄像头驱动和电源管理芯片为主攻方向。公司海归背景核心研发团队倾力打造系列触控产品,拥有多项核心技术专利,成功实现累计销售近亿颗。公司总部位于浙江余姚,在上海深圳分别设立研发中心和销售中心,持续迭代创新研发新产品,响应市场服务全国客户。

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基合半导体 Financing History (1 rounds)

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A+轮
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 金额未透露
  • Investor: 高能资本

基合半导体 How Fast Is Hiring Growing? (8 open positions)

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?
Growth Rate
2026 vs 2025
  • 2025: Down 8%
  • 2024: Up 150%
  • 2023: Down 63%
  • 2022: Down 48%
基合半导体 Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
基合半导体 Campus Recruitment & Advanced Degree Talent Demand
Interns 1 Master's 1
Note: How fast is hiring at 基合半导体(宁波)有限公司 growing? 基合半导体2025年23个(下降8%),2024年25个(增长150%),2023年10个(下降63%),2022年27个(下降48%),2021年52个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

基合半导体 Master's Degree Job Demand Analysis

(More)
?
Growth Rate
2026 vs 2025
  • 2025: Up 100%
  • 2022: Up 25%
基合半导体 Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 基合半导体(宁波)有限公司 growing? 基合半导体历年硕士招聘职位量:2025年8个(增长100%),2024年4个,2022年5个(增长25%),2021年4个.

基合半导体 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 基合半导体(宁波)有限公司? Based on an analysis of 基合半导体's job postings over the past year, “计算机/网络/技术类”需求占52.2%,“电子/电器/通信技术类”占47.8%,“其他(研发和技术类)”占39.1%,“医疗卫生/美容保健类”占4.3%. For reference only.

基合半导体 — What Are the Salaries Like? (23 records)

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salary range: 2K - 50K, 69.6% of roles pay ¥20-50K
Note: salary statistics are based on 23 salary records from the past year and depend on the job sample. For reference only.
基合半导体(宁波)有限公司工资待遇怎么样?基合半导体69.6%的岗位拿20-50K,应届生工资¥2.5K。宁波地区工资排名前5%,与同行业比+102%,计算机/网络/技术类平均工资¥33.3K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 基合半导体

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Are salaries high at 基合半导体(宁波)有限公司? We provide: 设计工程师,开发工程师,软件开发,嵌入式,电路设计,算法,ae,后端,c++,fa,会计,公共关系,实习生,工艺工程,总账,技术支持,财务. Click to view detailed salary analysis by job.

基合半导体 honors, qualifications & industry associations

基合半导体 Related Industry Tags

Job Category

  • 计算机/网络/技术类
    52.2% of total 52.2%
  • 电子/电器/通信技术类
    47.8% of total 47.8%
  • 其他(研发和技术类)
    39.1% of total 39.1%
  • 财务/审计/统计类
    8.7% of total 8.7%

Education

  • 本科
    52.2% of total 52.2%
  • 硕士
    30.4% of total 30.4%
  • 大专
    13% of total 13%
  • 不限
    4.3% of total 4.3%

Experience

  • 不限
    47.8% of total 47.8%
  • 3-5年
    34.8% of total 34.8%
  • 1-3年
    8.7% of total 8.7%
  • 应届生
    4.3% of total 4.3%
View Detailed Analysis

What does 基合半导体(宁波)有限公司 require? Who is 基合半导体 hiring? 基合半导体招聘类别计算机/网络/技术类占比最多占52.2%,其次是电子/电器/通信技术类占47.8%。基合半导体什么学历能进?本科占比最多占52.2%,其次是硕士占30.4%。基合半导体学历要求高吗?硕士占30.4%。工作经验基合半导体有什么要求?不限占比最多占47.8%,其次是3-5年占34.8%。基合半导体工作地区在哪?上海占比最多占69.6%,其次是深圳占26.1%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 1,343.706万(元)
Legal Representative: BO XIA
Date Established:
Credit Code: 91330281MA2AFTNE1G
Registered Address: 浙江省余姚市经济开发区城东新区冶山路

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