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Company Overview

Development Stage

About the Company

成都兴胜半导体材料有限公司(原成都住矿电子有限公司)于1998成立成都市高新区新加坡工业园,是一家外商独资重点高新科技生产企业,主营引线框架类半导体材料和精密模具的开发、生产及销售。

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How Fast Is Hiring Growing? (18 open positions)

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Note: How fast is hiring at 成都兴胜半导体材料有限公司 growing? 2025年14个(增长250%),2024年4个,2022年7个(下降61%),2021年18个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

— What Are the Salaries Like? (24 records)

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salary range: 4.5K - 8K, 100% of roles pay ¥4.5-8K
Note: salary statistics are based on 24 salary records from the past year and depend on the job sample. For reference only.
成都兴胜半导体材料有限公司工资待遇怎么样?100%的岗位拿4.5-8K,本科工资¥。与同行业比-62%,技工类平均工资¥5.9K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

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Are salaries high at 成都兴胜半导体材料有限公司? We provide: 电镀,操作员,模具,生产主任,生产倒班主管,冲压,品管,客服,操作工,普工,检验,物料计划,磨工,计划专员,设计专员,设计技术员,财务,质检. Click to view detailed salary analysis by job.

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Related Industry Tags

Job Category

  • 技工类
    66.7% of total 66.7%
  • 机械/仪器仪表类
    25% of total 25%
  • 生物/制药/化工/环保类
    25% of total 25%
  • 工厂生产类
    20.8% of total 20.8%

Education

  • 本科
    37.5% of total 37.5%
  • 大专
    33.3% of total 33.3%
  • 高中
    29.2% of total 29.2%

Experience

  • 不限
    58.3% of total 58.3%
  • 1-3年
    37.5% of total 37.5%
  • 3-5年
    4.2% of total 4.2%
View Detailed Analysis

What does 成都兴胜半导体材料有限公司 require? Who is 成都兴胜半导体材料有限公司 hiring? 招聘类别技工类占比最多占66.7%,其次是机械/仪器仪表类占25%。什么学历能进?本科占比最多占37.5%,其次是大专占33.3%。工作经验有什么要求?不限占比最多占58.3%,其次是1-3年占37.5%。工作地区在哪?成都占比最多占100%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 850万(美元)
Legal Representative: 苏振平
Date Established:
Credit Code: 91510100713008950L
Registered Address: 成都高新区新园南二路7号1栋1-2层、7栋1-2层

Partners & Suppliers

向其供应引线框架等封装材料 Source
合作客户 半导体封测
向其供应引线框架等封装材料 Source
合作客户 半导体封测
向其供应引线框架等封装材料 Source
合作客户 半导体封测
向其供应引线框架等封装材料 Source
合作客户 半导体封测
向其供应引线框架等封装材料 Source
合作客户 半导体封测

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