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About the Company

[Summary] 碳化硅半导体设备研发商

江苏卓远半导体有限公司,成立于2018年6月份,总投资1.2亿元。主要从事的是碳化硅半导体设备的技术研究、生产、销售,公司的产品涵盖了第三代半导体“碳化硅(SiC)”与 氮化镓(GaN)应用的整个全产业链,其中包括:碳化硅(SiC)单晶制造装备、碳化硅(SiC)单晶生产、碳化硅(SiC)晶圆片、氮化镓外延片等,公司将在3-5年内发展成为全球人工晶体材料供应的*企业,辐射国内外人工晶体材料及智能装备供应领域,成为*具影响力的晶体材料解决方案专家,不断提升公司的核心竞争力。

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卓远半导体 Financing History (6 rounds)

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Latest Financing Round
  • Date: ?
  • Amount: 融资金额未公开
  • Investor: 凯得金控

卓远半导体 honors, qualifications & industry associations

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卓远半导体 Related Industry Tags

Business Registration

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Operating Status: 开业
Registered Capital: 2,740.2862万(元)
Legal Representative: 张新峰
Date Established:
Credit Code: 91320682MA1WNX4T69
Registered Address: 如皋市城南街道电信东一路6号

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