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About the Company

公司总部成立于2008年,致力于IC托盘销售, 模具加工, 半导体材料和设备相关的生产和贸易。公司总部设在上海、在韩国、苏州、铜陵、南通、东莞、设有工厂,南京设有分公司,全力协助合作伙伴,满足不同地区客户需求。公司执着于“环境保护、品质保证、经济可行”三者的和谐统一,一直努力与各大半导体制造企业建立长期稳定的合作关系。

公司还致力于半导体模具和半导体自动化设备的研究开发、生产制造及相关服务。通过不断创新,加快产品更新速度,提高产品技术含量,确保公司在国内外半导体模具和自动化设备领域的领先地位,加强与国内高校及国际先进封装企业的合作,提高企业竞争力和国际市场占有率,随着国内半导体工业的发展而不断壮大。公司模具中心配置日本产精密检测设备,拥有美国MOORE和国产精密坐标磨床、日本产和国产精密坐标镗床、瑞士夏米尔和日本三菱精密慢走丝线切割机床、日本SODICK精密坐标电火花机床、德国产数控铣床、日本曲线磨床、成型磨床及日本产电火花加工机床、快走丝线切割加工机床等精密加工设备;可提供高精度的半导体塑封模具、切筋切断模具、高速冲压模具、各型精密模具备件。 公司自动化团队以精确、稳定、高效为机械设计原则,以诚信、负责为经营理念,专业半导体生产相关自动化设备。配合公司先进的机件加工设备,力求零件的精度及标准化,以确保品质;经验丰富的机械设计研发及软件程式编写部门,使我们的设备始终保持着先进﹑自动﹑自主的领先地位,并能依客户之需求作积极的生产配合

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Operating Status: 开业
Registered Capital: 6,600万(元)
Legal Representative: 孙丹丹
Date Established:
Credit Code: 91320691MA1WDXDD8G
Registered Address: 江苏省南通市崇川区盘香路111号

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