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About the Company

[Summary] 端侧SoC芯片

为旌科技是一家集成电路设计企业,于2020年8月注册成立,拥有上海、深圳、北京、西安四大研发中心。自成立以来,为旌专注于中高端智能感知芯片设计与研发,掌握视频编解码,图像处理,低功耗,人工智能加速器等 SOC 关键技术,为客户提供有竞争力的智能感知芯片及解决方案。
公司创始人兼 CEO 郑军先生有二十多年芯片开发和量产经验,创办为旌科技之前,郑军先生曾任海思上海分部部长和 Kirin 芯片及技术开发部副部长(主持工作),成功完成 Kirin920 到 Kirin990 5G 等 Kirin 全系列芯片交付,支撑华为中高端品牌手机的成功商用。
公司目前已快速成长到近200 人的规模,组织架构完备,在算法架构、设计、验证、后端、软件、运营、量产、销售及服务等各个环节都有行业资深专家,具备丰富的应用处理器芯片开发和量产经验。其中研发人员占比90%,硕博士学历占比超过65%,核心团队平均工作经验 15 年以上。为旌科技致力于成为国际一流的集成电路设计企业,以感知和计算,服务数字世界和万物智能。

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为旌科技 Financing History (8 rounds)

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A+轮
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 3亿人民币
  • Investor: 君信资本,扬子国投

为旌科技 How Fast Is Hiring Growing? (18 open positions)

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?
Growth Rate
2026 vs 2025
  • 2025: Down 51%
  • 2024: Down 42%
  • 2023: Down 47%
  • 2022: Up 116%
为旌科技 Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
为旌科技 Campus Recruitment & Advanced Degree Talent Demand
Master's 3
Note: How fast is hiring at 上海为旌科技有限公司 growing? 为旌科技2025年18个(下降51%),2024年37个(下降42%),2023年64个(下降47%),2022年121个(增长116%),2021年56个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

为旌科技 Master's Degree Job Demand Analysis

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?
Growth Rate
2026 vs 2025
  • 2025: Down 43%
  • 2024: Down 61%
  • 2023: Up 80%
为旌科技 Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 上海为旌科技有限公司 growing? 为旌科技历年硕士招聘职位量:2025年4个(下降43%),2024年7个(下降61%),2023年18个(增长80%),2022年10个.

为旌科技 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 上海为旌科技有限公司? Based on an analysis of 为旌科技's job postings over the past year, “计算机/网络/技术类”需求占73.1%,“电子/电器/通信技术类”占53.8%,“其他(研发和技术类)”占11.5%,“医疗卫生/美容保健类”占11.5%,“电气/能源/动力类”占3.8%. For reference only.

为旌科技 — What Are the Salaries Like? (26 records)

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为旌科技 Salary Overview
salary range: 20K - 50K, 100% of roles pay ¥20-50K
Note: salary statistics are based on 26 salary records from the past year and depend on the job sample. For reference only.
上海为旌科技有限公司工资待遇怎么样?为旌科技100%的岗位拿20-50K,本科工资¥。上海地区工资排名前20%,与同行业比+52%,计算机/网络/技术类平均工资¥36.8K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 为旌科技

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Are salaries high at 上海为旌科技有限公司? We provide: 软件工程,开发工程师,ae,fa,现场支持工程师,算法,影像,测试开发,测试经理,质量,销售,android,bsp开发,pi,te,后端,封装工程师,嵌入式,测试工程,自动化. Click to view detailed salary analysis by job.

为旌科技 honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

为旌科技 Related Industry Tags

Job Category

  • 计算机/网络/技术类
    73.1% of total 73.1%
  • 电子/电器/通信技术类
    53.8% of total 53.8%
  • 质量管理类
    26.9% of total 26.9%
  • 其他(研发和技术类)
    11.5% of total 11.5%

Education

  • 本科
    80.8% of total 80.8%
  • 硕士
    19.2% of total 19.2%

Experience

  • 1-3年
    26.9% of total 26.9%
  • 不限
    26.9% of total 26.9%
  • 3-5年
    23.1% of total 23.1%
  • 5-10年
    23.1% of total 23.1%
View Detailed Analysis

What does 上海为旌科技有限公司 require? Who is 为旌科技 hiring? 为旌科技招聘类别计算机/网络/技术类占比最多占73.1%,其次是电子/电器/通信技术类占53.8%。为旌科技什么学历能进?本科占比最多占80.8%,其次是硕士占19.2%。为旌科技学历要求高吗?硕士占19.2%。工作经验为旌科技有什么要求?1-3年占比最多占26.9%,其次是不限占26.9%。为旌科技工作地区在哪?南京占比最多占42.3%,其次是上海占19.2%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 706.4941万(元)
Legal Representative: 郑军
Date Established:
Credit Code: 91310000MA1H37DQ5W
Registered Address: 上海市黄浦区福州路480号底层116室

Partners & Suppliers

为为旌科技提供芯片代工服务 Source
供应商 芯片代工
为其安防摄像头提供ISP芯片 Source
合作客户 安防客户
为其安防摄像头提供ISP芯片 Source
合作客户 安防客户

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为旌科技 Competitors (Similar Companies)

“实时音视频通信服务商”
“智能音视频处理器SOC研发设计商”
“一站式芯片定制服务”
“以存储科技赋能信息社会,改善人类生活”
“打造实现梦想的一流平台。”
软件 大数据 数据服务 风险监控
耐火 导线 高温电缆 特种电线电缆
“成为芯片全产业链测试方案提供商”
教育科技 科研机构 科学研究 研发
“成为全球化运营的一流化工新材料公司”
光学 蓝牙 模具制造 SMT
软件 人工智能 区块链 智慧医疗
IoT 路由器 物联网 国内电商
“一个高性能CMOS图像传感器产品设计公司”
集成电路封装测试 集成电路封装 半导体封装测试 封装测试

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