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Company Overview

Development Stage

About the Company

公司拥有一流的办公环境和现代化科研生产车间8000平方米,产品有五大系列近300个品种,年生产能力1000万(套)产品,集成电路等,主要产品黑陶瓷低温玻璃封装外壳(CERDIP、CFP两种)产品应用航天、航空、、计算机、汽车、医疗器械以及对质量可靠性要求较高的微电子封装领域。用于民用领域、形成集科研、生产、销售、技术服务等一条龙式产业链,为100多家科研院所和企事业单位提供产品.

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How Fast Is Hiring Growing? (9 open positions)

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Note: How fast is hiring at 福建省创鑫微电子有限公司 growing? 2025年18个(增长20%),2024年15个(下降29%),2023年21个(增长163%),2022年8个(增长33%),2021年6个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

— What Are the Salaries Like? (19 records)

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salary range: 3K - 10K, 68.5% of roles pay ¥4.5-8K
Note: salary statistics are based on 19 salary records from the past year and depend on the job sample. For reference only.
福建省创鑫微电子有限公司工资待遇怎么样?68.5%的岗位拿4.5-8K,本科工资¥。与同行业比-54%,技工类平均工资¥6.2K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Job Category

  • 技工类
    47.4% of total 47.4%
  • 工厂生产类
    36.8% of total 36.8%
  • 质量管理类
    26.3% of total 26.3%
  • 机械/仪器仪表类
    15.8% of total 15.8%

Education

  • 大专
    47.4% of total 47.4%
  • 本科
    26.3% of total 26.3%
  • 高中
    15.8% of total 15.8%
  • 初中
    5.3% of total 5.3%

Experience

  • 不限
    63.2% of total 63.2%
  • 3-5年
    15.8% of total 15.8%
  • 1-3年
    10.5% of total 10.5%
  • 5-10年
    10.5% of total 10.5%
View Detailed Analysis

What does 福建省创鑫微电子有限公司 require? Who is 福建省创鑫微电子有限公司 hiring? 招聘类别技工类占比最多占47.4%,其次是工厂生产类占36.8%。什么学历能进?大专占比最多占47.4%,其次是本科占26.3%。工作经验有什么要求?不限占比最多占63.2%,其次是3-5年占15.8%。工作地区在哪?福州占比最多占100%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 1,000万(元)
Legal Representative: 赵桂林
Date Established:
Credit Code: 91350702MA359YAP7L
Registered Address: 福州高新区南屿镇芯园路第三代半导体数字产业园项目(一期)3#厂房4层东侧

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