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Company Overview

Development Stage

About the Company

高美可科技(无锡)有限公司是2005年7月26日成立的韩国外商投资经营企业。本公司的主要经营项目为:生产无机非金属材料及制品;生产半导体元器件专用材料;五金件;精密仪器设备的维修及售后服务。 欢迎大家加入!

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How Fast Is Hiring Growing? (8 open positions)

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?
Growth Rate
2026 vs 2025
  • 2025: Up 171%
  • 2024: Up 40%
  • 2023: Up 25%
  • 2022: Down 38%
Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
Note: How fast is hiring at 高美可科技(无锡)有限公司 growing? 2025年38个(增长171%),2024年14个(增长40%),2023年10个(增长25%),2022年8个(下降38%),2021年13个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

— What Are the Salaries Like? (27 records)

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salary range: 4.5K - 30K, 62.9% of roles pay ¥4.5-8K
Note: salary statistics are based on 27 salary records from the past year and depend on the job sample. For reference only.
高美可科技(无锡)有限公司工资待遇怎么样?62.9%的岗位拿4.5-8K,本科工资¥。与同行业比-48%,销售类平均工资¥10.7K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

(More)
Are salaries high at 高美可科技(无锡)有限公司? We provide: 销售,韩语,总务,人事,售后,技术工程师,操作工,会计,司机,后勤,安全,操作员,文员,物流操作,设备管理,财务,质量,资材. Click to view detailed salary analysis by job.

Related Industry Tags

Job Category

  • 销售类
    40.7% of total 40.7%
  • 翻译类
    22.2% of total 22.2%
  • 技工类
    18.5% of total 18.5%
  • 行政/后勤类
    18.5% of total 18.5%

Education

  • 本科
    48.1% of total 48.1%
  • 大专
    29.6% of total 29.6%
  • 高中
    22.2% of total 22.2%

Experience

  • 不限
    63% of total 63%
  • 1-3年
    33.3% of total 33.3%
  • 5-10年
    3.7% of total 3.7%
View Detailed Analysis

What does 高美可科技(无锡)有限公司 require? Who is 高美可科技(无锡)有限公司 hiring? 招聘类别销售类占比最多占40.7%,其次是翻译类占22.2%。什么学历能进?本科占比最多占48.1%,其次是大专占29.6%。工作经验有什么要求?不限占比最多占63%,其次是1-3年占33.3%。工作地区在哪?无锡占比最多占66.7%,其次是青岛占11.1%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 3,700万(美元)
Legal Representative: 都京柱(DO KYUNG JOO)
Date Established:
Credit Code: 9132021477686480XX
Registered Address: 无锡市新吴区新硕路9-5号

Partners & Suppliers

高美可科技为中微公司提供刻蚀设备核心部件 Source
合作客户 半导体设备
高美可科技为上海微电子提供光刻机相关部件 Source
合作客户 半导体设备
高美可科技向北方华创供应半导体设备零部件 Source
合作客户 半导体设备
高美可科技向东京电子供应半导体设备零部件 Source
合作客户 半导体设备
高美可科技向应用材料提供半导体设备核心部件 Source
合作客户 半导体设备

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