Xinchuangyuan Semiconductor

Wuhan Xinchuangyuan Semiconductor Co., Ltd. is a newly established business entity formed in 2021 through the reorganization of Optics Valley Chuangyuan and Zhuhai Chuangyuan. The company is headquartered on Jiulonghu Street in Wuhan Optics Valley Future Technology City, covering an area of approximately 150 mu. The total project investment is expected to be 6 billion yuan, and the main product is packaging substrates for integrated circuits. The company possesses original core technologies such as ion implantation coating, which can produce finer circuits than conventional processes. The company's customers and products mainly target the following areas: CSP substrates based on BT for memory, mobile phones, TV main ICs, etc.; FC-BGA substrates based on ABF for CPU, GPU, XPU, etc.; and most notably, large-area, fine-line-width, high-frequency and high-speed packaging substrates for Chiplets.
Xinchuangyuan's subsidiary, Junyou Electric & Electronic Products (Shenzhen) Co., Ltd., specializes in producing flexible printed circuits (FPC), focusing on the mobile phone and panel fields. Thanks to the use of ion implantation coating additive method, it is particularly skilled at producing ultra-fine circuits. In addition to ordinary FPCs for mobile phones and panels, it can also produce millimeter-wave antennas, wireless charging, and silicon-free and magnet-free ultra-clean FPCs; VCM coils used in mobile phone optical image stabilization lenses and TSA anti-shake suspension devices are also the company's featured products. The SMT production line is fully equipped and can meet the requirements of the Apple supply chain.