About the Company

新郦璞科技(上海)有限公司:高新技术企业,注册落户于上海自贸区临港新片区,并在漕河泾和张江设有研发中心。公司核心创始团队毕业于交通大学、清华大学、 中国科学技术大学等著名高校,平均产业经验超过15年且均为曾任职国际知名半导体企业的技术和市场精英人士。 公司专注于感知-计算-通信融合芯片的设计与创新, 具备国际先进的包括数字、混合信号、模拟以及射频的完整SoC芯片的设计研发流程和规范,可为客户提供工业与物联网边缘端芯片解决方案以及通信网络芯片解决方案。 公司已完成战略融资近亿元,主要投资方包括业内芯片设计标杆企业与产业投资基金。

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Financing History (1 rounds)

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  • Amount: 融资金额未公开
  • Investor: 沃衍资本

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Operating Status: 开业
Registered Capital: 1,116.2352万(元)
Legal Representative: 周健军
Date Established:
Credit Code: 91310000MA1H395Y54
Registered Address: 中国(上海)自由贸易试验区临港新片区海洋一路333号1号楼、2号楼

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