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About the Company

新基讯成立于2021年4月,由核心团队与中关村融信金融信息化产业联盟的核心投资平台智路资本发起,聚焦物联网移动通信技术和基带SoC芯片产品,专注基于4G/5G/低轨卫星网络的大连接,低功耗,低成本等适用于广域物联网的移动通信技术,设计和研制适用于物联网终端的基带SoC芯片,包含基带、射频、PMIC及物联网应用处理器等组件。新基讯目前已经建立超过百人的研发设计团队,分布于上海、南京、成都和珠海。新基讯核心团队成员具有20年的移动通信和基带芯片公司从业经历,领导过2G/3G/4G/5G技术开发和产品研制,具备5G基带芯片产品的量产经验,公司多位创始人拥有成功创业经历。

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Operating Status: 开业
Registered Capital: 5,000万(元)
Legal Representative: 刘洋
Date Established:
Credit Code: 91510100MA6BJ06Q2F
Registered Address: 中国(四川)自由贸易试验区成都高新区和乐二街171号6栋2单元19层

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