Company Overview

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About the Company

[Summary] To build a top domestic integrated circuit design company and create a

The company is located in Building G1, Tianfu Software Park, No. 1800, Middle Section of Yizhou Avenue, High-tech Zone, Chengdu, with an office area of nearly 3,500 square meters. It is one of the national "909" engineering construction projects, established in March 2000, with a registered capital of 190 million yuan. The company focuses on chip design, supplemented by electronic application product development and technical services. With "integrity, harmony, hard work, and innovation" as its corporate philosophy, "a broad mind to accommodate all rivers, unyielding will, quality of kindness, and spirit of pursuing excellence" as its corporate spirit, "gathering talents, grasping the market, challenging technology, and creating the future" as its development strategy, and "building a top domestic integrated circuit design company and creating a better tomorrow for the information society" as its corporate mission. The company possesses digital-analog mixed-signal design technologies including 90nm CMOS, 0.18μm Bi-CMOS, and advanced BCD processes, and holds advantages domestically in series products of programmable logic devices, A/D, D/A, analog circuits, and interface circuits. It has technologies for programmable logic devices CPLD, FPGA hardware design platforms, programmable logic device synthesis, mapping, and programming algorithm software platforms, SOPC design technologies embeddable with MCU, DSP, DLL, I/O, etc., A/D and D/A design technologies such as delta-sigma, pipeline, and successive approximation, PCI, VME, 1394 and other design technologies, high-frequency digital output LVDS design technology, CMOS high-precision bandgap reference design technology, PWM and PFM design technologies, highly reliable anti-ESD, EMI, and Environment design technologies, and fault diagnosis and scan testing technologies.

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Chengdu Huawei Micro Financing History (1 rounds)

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IPO上市
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Market:
  • Deal: 上交所

Chengdu Huawei Micro How Fast Is Hiring Growing? (37 open positions)

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Note: How fast is hiring at Chengdu Huawei Microelectronics Technology Co., Ltd. growing? Chengdu Huawei Micro2025: 132 openings (up 89%), 2024: 70 openings (up 3%), 2023: 68 openings (down 26%), 2022: 92 openings (down 5%), 2021: 97 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

Chengdu Huawei Micro Master's Degree Job Demand Analysis

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How fast is master's hiring at Chengdu Huawei Microelectronics Technology Co., Ltd. growing? Chengdu Huawei MicroMaster's recruitment over the years: 2025: 22 openings (up 47%), 2024: 15 openings (up 275%), 2023: 4 openings (up 100%), 2022: 2 openings (up 100%), 2021: 1 openings.

Chengdu Huawei Micro R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at Chengdu Huawei Microelectronics Technology Co., Ltd.? Based on an analysis of Chengdu Huawei Micro's job postings over the past year, "电子/电器/通信技术类" demand: 68.3%, "计算机/网络/技术类": 26.8%, "其他(研发和技术类)": 24.6%, "生物/制药/化工/环保类": 3.5%, "美术/设计/创意类": 1.4%, "医疗卫生/美容保健类": 0.7%. For reference only.

Chengdu Huawei Micro — What Are the Salaries Like? (142 records)

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salary range: 6K - 50K, 57.1% of roles pay ¥20-50K
Note: salary statistics are based on 142 salary records from the past year and depend on the job sample. For reference only.
How is the salary at Chengdu Huawei Microelectronics Technology Co., Ltd.?Chengdu Huawei Micro57.1% of positions earn 20-50K, Fresh graduate salary: ¥7.0K。Chengdu salary ranking top 20,电子/电器/通信技术类 average salary ¥26.5K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of Chengdu Huawei Micro

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Are salaries high at Chengdu Huawei Microelectronics Technology Co., Ltd.? We provide: 销售,设计工程师,开发工程师,测试工程,电路设计,ic设计,技术支持,软件开发,硬件,验证工程师,fa,fpga,芯片设计,ae,前端,模拟设计,算法,芯片测试,dft,pi. Click to view detailed salary analysis by job.

Chengdu Huawei Micro — Fortune 500? (More)

Chengdu Huawei Micro honors, qualifications & industry associations

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Chengdu Huawei Micro Related Industry Tags

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Job Category

  • 电子/电器/通信技术类
    68.3% of total 68.3%
  • 销售类
    32.4% of total 32.4%
  • 计算机/网络/技术类
    26.8% of total 26.8%
  • 其他(研发和技术类)
    24.6% of total 24.6%

Education

  • 本科
    59.2% of total 59.2%
  • 硕士
    39.4% of total 39.4%
  • 高中
    0.7% of total 0.7%
  • 大专
    0.7% of total 0.7%

Experience

  • 3-5年
    40.1% of total 40.1%
  • 5-10年
    39.4% of total 39.4%
  • 不限
    14.8% of total 14.8%
  • 1-3年
    4.9% of total 4.9%
View Detailed Analysis

What does Chengdu Huawei Microelectronics Technology Co., Ltd. require? Who is Chengdu Huawei Micro hiring? Chengdu Huawei Micro recruitment: 电子/电器/通信技术类占比最多占68.3%,其次是销售类占32.4%. What education can get in at Chengdu Huawei Micro? 本科占比最多占59.2%,其次是硕士占39.4%. High education required at Chengdu Huawei Micro? 硕士占39.4%. Work experience required at Chengdu Huawei Micro? 3-5年占比最多占40.1%,其次是5-10年占39.4%. Where are the job locations at Chengdu Huawei Micro? 成都占比最多占51.4%,其次是上海占12.7%. Based on job postings from the past year, for reference only.

Business Registration

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Operating Status: 开业
Registered Capital: 63,684.7026万(元)
Legal Representative: 王策
Date Established:
Credit Code: 91510100720342949A
Registered Address: 中国(四川)自由贸易试验区成都高新区益州大道中段1800号1栋22-23层2201号、2301号

Partners & Suppliers

向公司提供集成电路、FPGA等芯片产品 Source
合作客户 芯片/半导体
为成都航天通信设备有限责任公司提供集成电路与微系统产品 Source
合作客户 电子元器件
成都华微向海格通信供应数字电路及模拟集成电路芯片。 Source
合作客户 集成电路
电子元器件检测服务客户 Source
供应商 集成电路设计企业客户
采购特种集成电路产品 Source
合作客户 船舶客户

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