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Development Stage

About the Company

[Summary] 电子封装用环氧塑封料研发商

道宜半导体成立于2020年05月,是一家专业从事于各种半导体器件、集成电路、功率模块等电子封装用环氧塑封料的研发、制造、销售和技术服务企业。

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Information is aggregated from the web and may not be exact. For reference only.
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道宜半导体 Financing History (6 rounds)

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B轮
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 融资金额未公开
  • Investor: 海恒资本

道宜半导体 How Fast Is Hiring Growing? (6 open positions)

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Note: How fast is hiring at 上海道宜半导体材料有限公司 growing? 道宜半导体2025: 10 openings (up 11%), 2024: 9 openings (up 13%), 2023: 8 openings (flat), 2022: 8 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

道宜半导体 — What Are the Salaries Like? (14 records)

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道宜半导体 Salary Overview
salary range: 6K - 50K, 50% of roles pay ¥6-10K
Note: salary statistics are based on 14 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 上海道宜半导体材料有限公司?道宜半导体50% of positions earn 6-10K, Undergraduate salary: ¥。工厂生产类 average salary ¥12.0K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

道宜半导体 honors, qualifications & industry associations

道宜半导体 Related Industry Tags

Job Category

  • 工厂生产类
    28.6% of total 28.6%
  • 其他(研发和技术类)
    21.4% of total 21.4%
  • 客户服务类
    14.3% of total 14.3%
  • 技工类
    14.3% of total 14.3%

Education

  • 本科
    71.4% of total 71.4%
  • 大专
    28.6% of total 28.6%

Experience

  • 不限
    85.7% of total 85.7%
  • 5-10年
    14.3% of total 14.3%
View Detailed Analysis

What does 上海道宜半导体材料有限公司 require? Who is 道宜半导体 hiring? 道宜半导体 recruitment: 工厂生产类占比最多占28.6%,其次是其他(研发和技术类)占21.4%. What education can get in at 道宜半导体? 本科占比最多占71.4%,其次是大专占28.6%. Work experience required at 道宜半导体? 不限占比最多占85.7%,其次是5-10年占14.3%. Where are the job locations at 道宜半导体? 上海占比最多占92.9%,其次是深圳占7.1%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 6,942.6万(元)
Legal Representative: 顾海勇
Date Established:
Credit Code: 91310000MA1H32JH61
Registered Address: 中国(上海)自由贸易试验区临港新片区正琅路19号4幢101室

Partners & Suppliers

上海道宜为通富微电提供先进封装用底部填充胶等材料。 Source
合作客户 半导体封装材料
上海道宜半导体材料有限公司为华天科技提供环氧塑封料等封装材料,并获评优秀供应商。 Source
合作客户 半导体封装材料
上海道宜的封装材料产品通过长电科技验证并实现批量供货。 Source
合作客户 半导体封装材料

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“Providing comprehensive PCB products and services”
智能硬件 半导体 体育科技 电子设备
物流园 仓储 仓储物流

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