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About the Company

深圳泰研半导体装备有限公司(简称:泰研半导体)成立于2017年,是一家专注于半导体先进封装领域专用设备的研发、生产、销售及技术服务的高新技术企业。公司自主研发的核心设备涵盖激光(Laser)、等离子体(Plasma)和溅镀(Sputter)三大系列,广泛应用于系统级封装(SiP)、扇出型封(Fanout)、小芯片封装(Chiplet)、TGV/2.5D封装等先进封装工艺,技术性能达到国际同类设备水平。

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Operating Status: 开业
Registered Capital: 1,000万(元)
Legal Representative: 张少波
Date Established:
Credit Code: 91440300MA5HBPRX1N
Registered Address: 深圳市光明区玉塘街道田寮社区根玉路与田寮路交汇处东南侧401

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