合肥颀材科技有限公司成立于2018年,注册资金10.7亿元人民币,位于合肥新站高新区综合保税区内,是一家集研发、生产、销售、服务一体化的中外合资企业,主要生产连接半导体显示芯片和终端产品的超精细柔性封装线路软板,致力于打造国内规模的半导体显示芯片封装COF卷带生产基地。产品广泛应用于显示器件、人工智能、车联网、可穿戴设备等领域,填补集成电路封测COF卷带材料国内产业空白。公司以自主产品为核心,发挥人才优势,为客户持续提供优质的产品和服务。
What does 合肥颀材科技有限公司 require? Who is 合肥颀材科技有限公司 hiring? recruitment: 质量管理类占比最多占42.9%,其次是技工类占35.7%. What education can get in at ? 本科占比最多占50%,其次是高中占21.4%. Work experience required at ? 不限占比最多占50%,其次是1-3年占28.6%. Where are the job locations at ? 合肥占比最多占100%. Based on job postings from the past year, for reference only.
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