Company Overview

Development Stage

About the Company

瓷金科技(河南)有限公司成立于2015年4月,是国内*一家实现集设备、半导体封装基座、金属盖板为一体的生产企业。从金属浆料、无机非金属材料、高分子材料、智能装备到高端模具;集模具与装备的结合、装备与工艺的结合;突破了半导体芯片封装材料的技术枷锁,成为国内仅有的两家(全球第三家)可以批量供应芯片封装基座的生产企业;系专业从事新材料为各类芯片封装领域提供整套解决方案的高新技术企业。产品广泛应用在智能手机、智能家居、通讯产品、GPS(卫星定位)、液晶显示驱动、鼠标、键盘、蓝牙音响、车载MP3、LCD控制板等领域。

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瓷金科技 How Fast Is Hiring Growing? (78 open positions)

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Growth Rate
2026 vs 2025
  • 2025: Up 381%
  • 2024: Up 45%
  • 2023: Up 22%
瓷金科技 Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
瓷金科技 Campus Recruitment & Advanced Degree Talent Demand
Master's 3
Note: How fast is hiring at 瓷金科技(河南)有限公司 growing? 瓷金科技2025: 77 openings (up 381%), 2024: 16 openings (up 45%), 2023: 11 openings (up 22%), 2022: 9 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

瓷金科技 Master's Degree Job Demand Analysis

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+50%
Growth Rate
2026 vs 2025
  • 2025: Down 33%
瓷金科技 Master's Hiring by Year: 2026 — 1 more jobs than 2025
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 瓷金科技(河南)有限公司 growing? 瓷金科技Master's recruitment over the years: 2026: 3 openings (up 50%), 2025: 2 openings (down 33%), 2024: 3 openings.

瓷金科技 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 瓷金科技(河南)有限公司? Based on an analysis of 瓷金科技's job postings over the past year, "其他(研发和技术类)" demand: 22.5%, "电子/电器/通信技术类": 16.7%, "生物/制药/化工/环保类": 12.7%, "计算机/网络/技术类": 12.7%, "机械/仪器仪表类": 8.8%, "电气/能源/动力类": 4.9%. For reference only.

瓷金科技 — What Are the Salaries Like? (101 records)

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瓷金科技 Salary Overview
salary range: 3K - 30K, 57.5% of roles pay ¥4.5-8K
Note: salary statistics are based on 101 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 瓷金科技(河南)有限公司?瓷金科技57.5% of positions earn 4.5-8K, Undergraduate salary: ¥。工厂生产类 average salary ¥6.4K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 瓷金科技

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Are salaries high at 瓷金科技(河南)有限公司? We provide: 研发工程师,设计工程师,工艺工程,材料研发,模具,电气,维修技术员,设计师,ae,fa,专利专员,业务经理,储备干部,实验室技术员,开发工程师,机械设计,bp,hr,pcb设计,产品工艺. Click to view detailed salary analysis by job.

瓷金科技 honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

瓷金科技 Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Job Category

  • 工厂生产类
    29.4% of total 29.4%
  • 技工类
    23.5% of total 23.5%
  • 其他(研发和技术类)
    22.5% of total 22.5%
  • 电子/电器/通信技术类
    16.7% of total 16.7%

Education

  • 本科
    49% of total 49%
  • 大专
    35.3% of total 35.3%
  • 高中
    7.8% of total 7.8%
  • 硕士
    4.9% of total 4.9%

Experience

  • 1-3年
    60.8% of total 60.8%
  • 不限
    18.6% of total 18.6%
  • 3-5年
    17.6% of total 17.6%
  • 5-10年
    2.9% of total 2.9%
View Detailed Analysis

What does 瓷金科技(河南)有限公司 require? Who is 瓷金科技 hiring? 瓷金科技 recruitment: 工厂生产类占比最多占29.4%,其次是技工类占23.5%. What education can get in at 瓷金科技? 本科占比最多占49%,其次是大专占35.3%. High education required at 瓷金科技? 硕士占4.9%. Work experience required at 瓷金科技? 1-3年占比最多占60.8%,其次是不限占18.6%. Where are the job locations at 瓷金科技? 郑州占比最多占89.2%,其次是洛阳占10.8%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 15,000万(元)
Legal Representative: 刘永良
Date Established:
Credit Code: 91410185341623863X
Registered Address: 河南省郑州市登封市中岳街道先进制造业开发区创新创业科技园9号楼

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