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About the Company

Information is aggregated from the web and may not be exact. For reference only.
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How Fast Is Hiring Growing? (6 open positions)

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Note: How fast is hiring at 芯云半导体(诸暨)有限公司 growing? 2025年47个(增长135%),2024年20个(下降39%),2023年33个(增长22%),2022年27个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

— What Are the Salaries Like? (43 records)

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salary range: 4.5K - 30K, 62.8% of roles pay ¥8-15K
Note: salary statistics are based on 43 salary records from the past year and depend on the job sample. For reference only.
芯云半导体(诸暨)有限公司工资待遇怎么样?62.8%的岗位拿8-15K,本科工资¥。绍兴地区工资排名第253,与同行业比-23%,工厂生产类平均工资¥11.6K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

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Are salaries high at 芯云半导体(诸暨)有限公司? We provide: 厂务,设备工,暖通,行政,课长,运维,ehs,产品技术员,人事,普工,物料员,电工,it工程师,pe,qe,te,产品工程,产品测试,保洁,制程技术员. Click to view detailed salary analysis by job.

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Related Industry Tags

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Job Category

  • 工厂生产类
    32.6% of total 32.6%
  • 技工类
    18.6% of total 18.6%
  • 质量管理类
    18.6% of total 18.6%
  • 电气/能源/动力类
    14% of total 14%

Education

  • 大专
    41.9% of total 41.9%
  • 本科
    37.2% of total 37.2%
  • 高中
    18.6% of total 18.6%
  • 初中
    2.3% of total 2.3%

Experience

  • 1-3年
    37.2% of total 37.2%
  • 3-5年
    34.9% of total 34.9%
  • 不限
    18.6% of total 18.6%
  • 5-10年
    9.3% of total 9.3%
View Detailed Analysis

What does 芯云半导体(诸暨)有限公司 require? Who is 芯云半导体(诸暨)有限公司 hiring? 招聘类别工厂生产类占比最多占32.6%,其次是技工类占18.6%。什么学历能进?大专占比最多占41.9%,其次是本科占37.2%。工作经验有什么要求?1-3年占比最多占37.2%,其次是3-5年占34.9%。工作地区在哪?绍兴占比最多占100%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 25,000万(元)
Legal Representative: 徐振
Date Established:
Credit Code: 91330681MA2JUD605U
Registered Address: 浙江省诸暨市暨阳街道兴农路9号312室

Partners & Suppliers

芯云半导体与杭州电子科技大学在人才培养和技术合作方面有合作 Source
供应商 高校合作
芯云半导体与浙江大学微电子学院建立联合实验室,进行技术研发 Source
供应商 高校合作
芯云半导体使用长川科技的测试分选机 Source
供应商 测试设备
芯云半导体采购华峰测控的测试机台 Source
供应商 测试设备
芯云半导体将部分封装业务外包给通富微电 Source
供应商 封测代工

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