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About the Company

江苏芯诺半导体科技有限公司总投资10亿元,其中固定资产投资约8亿元,占地130余亩,厂房32000多平方米,公司主营业务为半导体级及太阳能级硅片的研发、生产和销售,规划产能为年产太阳能级硅片3GW,6英寸半导体级硅晶圆片600万片。

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Operating Status: 开业
Registered Capital: 5,000万(元)
Legal Representative: 李炜
Date Established:
Credit Code: 91320925MA7DEMPU2E
Registered Address: 建湖县经济开发区天津路3号

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半导体 集成电路 芯片封装 集成电路封装测试
“半导体产品研销商”
半导体 抛光液 CMP设备 精密加工设备
半导体 硅片 光伏 硅片生产
电子厂/电子 薄膜电容器 电容 薄膜

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