江苏芯诺半导体科技有限公司总投资10亿元,其中固定资产投资约8亿元,占地130余亩,厂房32000多平方米,公司主营业务为半导体级及太阳能级硅片的研发、生产和销售,规划产能为年产太阳能级硅片3GW,6英寸半导体级硅晶圆片600万片。
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