Company Overview

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About the Company

江苏元夫半导体科技有限公司位于江苏省无锡市新吴区先导集团产业园,为无锡先导控股投资核心子公司,致力于研发、生产和销售CMP设备、抛光液、减薄机、减薄砂轮、晶圆激光切割设备等半导体精密加工设备和相应耗材,主要应用于先进半导体晶圆加工制造工艺环节。公司以“打破技术壁垒,国产替代进口”为己任,聚集海内优秀研发人才,通过扁平化管理模式,专业高效优质的为半导体行业高端客户持续提供更满意的产品和服务,同时整合和完善全球产业链,推动中国半导体产业更优更快向前发展,实现核心技术独立自主,逐步成为全球半导体设备供应商*企业。



欢迎全球范围内有志于半导体设备国产化事业的优秀人才携手共创伟业!

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元夫半导体 How Fast Is Hiring Growing? (68 open positions)

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Note: How fast is hiring at 江苏元夫半导体科技有限公司 growing? 元夫半导体2025: 136 openings (up 157%), 2024: 53 openings (up 89%), 2023: 28 openings (up 17%), 2022: 24 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

元夫半导体 Master's Degree Job Demand Analysis

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Growth Rate
2026 vs 2025
  • 2025: Up 300%
  • 2024: Up 33%
  • 2023: Up 50%
元夫半导体 Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 江苏元夫半导体科技有限公司 growing? 元夫半导体Master's recruitment over the years: 2025: 16 openings (up 300%), 2024: 4 openings (up 33%), 2023: 3 openings (up 50%), 2022: 2 openings.

元夫半导体 Doctoral Degree Job Demand Analysis

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Flat
Growth Rate
2026 vs 2025
  • 2025: Up 500%
  • 2024: Down 67%
元夫半导体 Doctoral Hiring by Year: 2026 — same as 2025
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is doctoral hiring at 江苏元夫半导体科技有限公司 growing? 元夫半导体Doctorate recruitment over the years: 2026: 6 openings (flat), 2025: 6 openings (up 500%), 2024: 1 openings (down 67%), 2023: 3 openings.

元夫半导体 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 江苏元夫半导体科技有限公司? Based on an analysis of 元夫半导体's job postings over the past year, "电子/电器/通信技术类" demand: 22.3%, "其他(研发和技术类)": 21.7%, "机械/仪器仪表类": 16.6%, "电气/能源/动力类": 11.5%, "计算机/网络/技术类": 11.5%, "生物/制药/化工/环保类": 3.2%. For reference only.

元夫半导体 — What Are the Salaries Like? (157 records)

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salary range: 6K - 50K, 51.6% of roles pay ¥15-30K
Note: salary statistics are based on 157 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 江苏元夫半导体科技有限公司?元夫半导体51.6% of positions earn 15-30K, Fresh graduate salary: ¥23.9K。Wuxi salary ranking top 35,其他(研发和技术类) average salary ¥24.6K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 元夫半导体

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Are salaries high at 江苏元夫半导体科技有限公司? We provide: 电气,采购,机械工,工艺工程,售后,外协,产品经理,生产计划,调试,质量,销售,产品工程,装配,研发工程师,行政,设备工,设计工程师,软件工程,me工程师,资深工程师. Click to view detailed salary analysis by job.

元夫半导体 honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

元夫半导体 Related Industry Tags

Job Category

  • 其他(研发和技术类)
    21.6% of total 21.6%
  • 电子/电器/通信技术类
    21.6% of total 21.6%
  • 技工类
    20.4% of total 20.4%
  • 质量管理类
    19.8% of total 19.8%

Education

  • 本科
    69.8% of total 69.8%
  • 大专
    13% of total 13%
  • 硕士
    11.7% of total 11.7%
  • 博士
    3.7% of total 3.7%

Experience

  • 5-10年
    35.8% of total 35.8%
  • 不限
    31.5% of total 31.5%
  • 3-5年
    19.8% of total 19.8%
  • 应届生
    7.4% of total 7.4%
View Detailed Analysis

What does 江苏元夫半导体科技有限公司 require? Who is 元夫半导体 hiring? 元夫半导体 recruitment: 其他(研发和技术类)占比最多占21.6%,其次是电子/电器/通信技术类占21.6%. What education can get in at 元夫半导体? 本科占比最多占69.8%,其次是大专占13%. High education required at 元夫半导体? 硕士占11.7%,博士占3.7%. Work experience required at 元夫半导体? 5-10年占比最多占35.8%,其次是不限占31.5%. Where are the job locations at 元夫半导体? 无锡占比最多占98.8%,其次是上海占1.2%. Based on job postings from the past year, for reference only.

Business Registration

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Operating Status: 开业
Registered Capital: 1,500万(元)
Legal Representative: 王燕清
Date Established:
Credit Code: 91320214MA223HR07X
Registered Address: 无锡市新吴区长江南路25号

Partners & Suppliers

江苏元夫半导体向通富微电供应研磨设备等 Source
合作客户 半导体封测设备
江苏元夫半导体向长电科技供应半导体切割设备 Source
合作客户 半导体封测设备
江苏元夫半导体向华天科技供应半导体划片机等封装设备 Source
合作客户 半导体封测设备

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元夫半导体 Competitors (Similar Companies)

“我们一起创造We make it together ”
“致力于高速光通信测试、光芯片测试和半导体测试三大领域测试仪器和设备的开发。”
“光器件整体解决方案提供商和光电先进封装制造服务商”
电路板 线路板 生产 计算机电路板
半导体 光学 人工智能 电子设备
键盘 鼠标 背光模块 键盘生产
传感器 服务机器人 机器人系统集成 智慧电力
电子厂/电子 电子系统 雷达 微波
“综合通信解决方案提供商”
“One of the semiconductor packaging and testing manufacturers”
“A high-tech company professionally engaged in the design, research and”
“A leading provider of power management and thermal management solution”
“惯性姿态传感器产品及解决方案提供商”
“High-tech enterprise specializing in the development of uncooled infra”
“3D视觉SOC及MEMS芯片模组研发商”

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