Maxscend

Jiangsu Maxscend Microelectronics Co., Ltd. was established on August 10, 2012, and was listed on the Shenzhen ChiNext on June 18, 2019. Stock abbreviation: Maxscend, stock code: 300782.
The company focuses on research, development, and sales in the field of RF front-end chips, mainly providing RF switches, RF low-noise amplifiers, RF filters, and other RF front-end chips to the market. Additionally, the company offers low-power Bluetooth microcontroller chips. The company has R&D or sales centers in Shanghai, Shenzhen, Chengdu, Chongqing, the United States, and South Korea, forming an efficient business collaboration network. With outstanding scientific research technology, high-quality products, and efficient and comprehensive services, the company has gradually developed into a domestic first-class RF device and wireless connection chip design company, accumulating a good brand reputation and rich customer resources both domestically and internationally, and has been widely recognized by customers. The company's RF front-end chip products are mainly applied in products of mobile smart terminal manufacturers such as Samsung, Xiaomi, vivo, and OPPO. The company's low-power Bluetooth products are mainly used in mobile smart terminal devices and products such as smart homes and wearable devices.
After years of deep cultivation and accumulation in the RF front-end application field, the company has established a stable, efficient, innovative professional team with a mature and complete management system, covering technology R&D, market sales, production operations, quality management, financial management, and other aspects. The core technical team, led by the company's founders, has obtained doctoral or master's degrees from first-class universities or research institutes at home and abroad, and has served well-known chip design manufacturers domestically and internationally, possessing excellent technical capabilities and rich product development experience. The company also attracts outstanding students from excellent universities across the country to join.
The company adheres to the tenet of "driven by technological innovation, aiming to meet customer needs," and is committed to building a first-class technology platform in the RF field, continuously conducting user demand research and technology development, expanding product coverage and application fields, strengthening supply chain management to improve product competitiveness, and increasing product market share, aiming to become a leading enterprise in the RF field domestically and internationally, providing comprehensive RF solutions to mainstream mobile smart terminal manufacturers. In the field of IoT applications, the company, based on its existing low-power Bluetooth microcontroller chip products, further improves the product line to cover various IoT technology application scenarios.