About the Company

精芯智能成立于2021年,是一家半导体封装测试装备供应商,掌握精密运动、机器视觉核心技术,精通精密运动、机器视觉、AI算法、高低温控制等领域,致力成为国际优秀的半导体封装测试装备提供商。

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精芯智能 Financing History (1 rounds)

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Latest Financing Round
  • Date: ?
  • Amount: 融资金额未公开
  • Investor: 水木创投

精芯智能 Recruitment Overview / Current Status (1 open positions)

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Note: How fast is hiring at 精芯智能装备(苏州)有限公司 growing? . A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

精芯智能 honors, qualifications & industry associations

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精芯智能 Related Industry Tags

Business Registration

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Operating Status: 开业
Registered Capital: 480.9798万(元)
Legal Representative: 谢世敏
Date Established:
Credit Code: 91320507MA254EBM53
Registered Address: 苏州市相城区高铁新城青龙港路286号长三角国际研发社区启动区9B幢1层 103 室

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