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About the Company

乾晶半导体有限公司,2020年7月成立于浙江大学杭州国际科创中心, 专注于宽禁带(第三代)半导体材料领域,目前与浙大科创中心先进半导体研究院成立联合实验室,共同承担 SiC材料的产业化任务,力争在三到五年内将公司打造成为国际知名的第三代半导体材料品牌和标杆企业,助力我国半导体产业的发展。

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Operating Status: 开业
Registered Capital: 16,000万(元)
Legal Representative: 王明华
Date Established:
Credit Code: 91330800MAC13QPA8P
Registered Address: 浙江省衢州市东港八路78号

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