Company Overview

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About the Company

广东鸿浩半导体设备有限公司主要从事泛半导体行业高端设备的研发、生产和销售服务。公司拥有包括“ 8寸/12寸化学气相沉积设备”、“先进封装 EMI仿制物理气相沉积设备”、“先进3D封装设备LASER-DEBON DER设备”、“A0I检测设备“、“智能全系列干式泵 DRY PUMP”等六大系列产品,所生产的半导体设备主要用于集成电路晶圆制造、6-12寸单晶圆处理,包括化合物半导体、Ⅲ -IV组半导体、IGBT功率半导体、MEMS 、RF射频、逻辑芯片工艺及前道晶圆加工处理环节。
我们秉承多年半导体科技研发实力,实现资源整合和优势互补,持续推进半导体及集成电路制造工艺装备和先进封装、新型显示、半导体照明、新能源光伏等泛半导体领域装备技术和产品开发,实现了国产高端半导体及新型显示装备“从点到线”的原始创新跨越,以产品迭代升级和成套解决方案为客户创造更大价值,致力于成为半导体智能高端装备制造的*。
开发出8寸CVD化学气相沉积设备、PVD物理气相沉积设备、先进封装Laser Debon der设备、Dry Pump、 Inline Sputter设备以及Onsite高浓度处理设备等系列产品。 我们秉承“优良品质和环保型”的核心理念,诚信经营的原则,积极进取,勇于开拓,加快产品研发步伐,提高专业技术能力,全面完善营销支持,逐步发展扩大品牌影响力,以高性能的生产设备、精湛的技艺、超群的产品质量,能迅速为顾客提供质优价廉、卓而不凡的产品。通过科学管理及持续改进过程的运用为顾客提供高附加值的产品和服务。

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Information is aggregated from the web and may not be exact. For reference only.
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How Fast Is Hiring Growing?

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Growth Rate
2026 vs 2025
  • 2025: Up 4%
  • 2024: Up 90%
Year-by-Year Hiring:
Note: How fast is hiring at 广东鸿浩半导体设备有限公司 growing? 2025: 79 openings (up 4%), 2024: 76 openings (up 90%), 2023: 40 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

Doctoral Degree Job Demand Analysis

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N/A
Growth Rate
Doctoral Hiring by Year: 2024 — same as 2023
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is doctoral hiring at 广东鸿浩半导体设备有限公司 growing? Doctorate recruitment over the years: 2024: 1 openings (up 90%), 2023: 1 openings.

R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 广东鸿浩半导体设备有限公司? Based on an analysis of 's job postings over the past year, "电子/电器/通信技术类" demand: 54.5%, "机械/仪器仪表类": 18.2%, "电气/能源/动力类": 9.1%. For reference only.

— What Are the Salaries Like? (22 records)

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salary range: 3K - 50K, 77.2% of roles pay ¥6-30K
Note: salary statistics are based on 22 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 广东鸿浩半导体设备有限公司?77.2% of positions earn 6-30K, Undergraduate salary: ¥。Foshan salary ranking top 35,电子/电器/通信技术类 average salary ¥24.9K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

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Are salaries high at 广东鸿浩半导体设备有限公司? We provide: 销售,法务,机械工,秘书,主管助理,电气,管理经理,董事长,项目管理,财务助理. Click to view detailed salary analysis by job.

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Job Category

  • 电子/电器/通信技术类
    54.5% of total 54.5%
  • 销售类
    40.9% of total 40.9%
  • 经营管理类
    36.4% of total 36.4%
  • 法律类
    22.7% of total 22.7%

Education

  • 本科
    72.7% of total 72.7%
  • 大专
    27.3% of total 27.3%

Experience

  • 1-3年
    45.5% of total 45.5%
  • 5-10年
    27.3% of total 27.3%
  • 3-5年
    13.6% of total 13.6%
  • 不限
    13.6% of total 13.6%
View Detailed Analysis

What does 广东鸿浩半导体设备有限公司 require? Who is 广东鸿浩半导体设备有限公司 hiring? recruitment: 电子/电器/通信技术类占比最多占54.5%,其次是销售类占40.9%. What education can get in at ? 本科占比最多占72.7%,其次是大专占27.3%. Work experience required at ? 1-3年占比最多占45.5%,其次是5-10年占27.3%. Where are the job locations at ? 佛山占比最多占100%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 6,900万(元)
Legal Representative: 冯嘉荔
Date Established:
Credit Code: 91440605MAA4K3QG29
Registered Address: 佛山市南海区里水镇和顺科顺路1号东区4栋2楼201号(住所申报)

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