晶度半导体成立于2018年6月,是一家晶圆生产商,致力于晶圆生产工艺研究,拥有晶圆凸块及集成电路封装、测试生产线,专业从事封装、测试、建设金凸块、COF、COG等先进封装生产工艺业务。
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