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Company Overview

Development Stage

About the Company

晶度半导体成立于2018年6月,是一家晶圆生产商,致力于晶圆生产工艺研究,拥有晶圆凸块及集成电路封装、测试生产线,专业从事封装、测试、建设金凸块、COF、COG等先进封装生产工艺业务。

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晶度半导体 Financing History (1 rounds)

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Latest Financing Round
  • Date: ?
  • Amount: 融资金额未公开
  • Investor: 安芙兰资本

晶度半导体 honors, qualifications & industry associations

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晶度半导体 Related Industry Tags

Business Registration

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Operating Status: 开业
Registered Capital: 6,400.742万(元)
Legal Representative: 凌永康
Date Established:
Credit Code: 91321183MA1WPDA38Y
Registered Address: 句容市开发区崇明西路102号8号楼

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