[Summary] One of the semiconductor packaging and testing manufacturers
Huatian Technology, established in 2003, is one of China's largest semiconductor packaging and testing manufacturers. In 2007, it was listed on the Shenzhen Stock Exchange (stock code: 002185), ranking 7th among global packaging and testing enterprises and 3rd domestically. Huatian Technology (Kunshan) Electronics Co., Ltd. primarily engages in ultra-large-scale semiconductor packaging, testing, and module production, possessing six major technology platforms: TSV, BUMPING, WLP, Fan-Out, FC, and Test. It hosts a national post-doctoral research workstation and a Jiangsu Province academician workstation, and is a key R&D institution in Jiangsu Province, as well as the Jiangsu Province TSV Through-Silicon Via 3D Packaging Engineering Technology Research Center.
Huatian Technology (Kunshan) Electronics Co., Ltd. has comprehensively deployed wafer-level advanced packaging technologies, independently developing cutting-edge packaging technologies such as silicon-based fan-out packaging, silicon-based embedded system-in-package, 3D stacking, and automotive electronics wafer-level packaging, reaching an international advanced level.
What does Huatian Technology (Kunshan) Electronics Co., Ltd. require? Who is Huatian Technology hiring? Huatian Technology recruitment: 技工类占比最多占28.8%,其次是电子/电器/通信技术类占25.4%. What education can get in at Huatian Technology? 本科占比最多占81.5%,其次是大专占13.5%. High education required at Huatian Technology? 硕士占3.2%,博士占0.8%. Work experience required at Huatian Technology? 3-5年占比最多占43.4%,其次是5-10年占26.3%. Where are the job locations at Huatian Technology? 南京占比最多占70.2%,其次是苏州占29.8%. Based on job postings from the past year, for reference only.
Congratulations, submitted successfully!
Your edit is under review. You will be notified by email within 1 business day.
Submission failed.
Help others learn about this company, add my impression of this company»
Log in with the following accounts to save your follows