Company Overview

Development Stage

About the Company

Shenzhen Honggang is a high-tech enterprise specializing in the research and development, production, and sales of optoelectronic device packaging shells, and a "Little Giant" enterprise recognized for its specialization, refinement, distinctiveness, and innovation. After more than 20 years of deep cultivation in the professional field and continuous technological accumulation, it has acquired independent mass production capability for metal packaging shells. Its products are widely used in lasers, optical communications, aerospace, and other industries, among which the market share of laser packaging shells is domestic. The company currently has more than 650 employees, including 32 with senior and intermediate professional titles, and fixed assets of 160 million yuan. It has established cooperative relationships with research institutes and universities such as the China Academy of Engineering Physics, the Changchun Institute of Optics, Fine Mechanics and Physics, and Tsinghua University. The company actively enhances its independent research and development innovation and scientific and technological achievement transformation capabilities, forming a core industrial strategic layout centered on metal packaging shells, CAC preformed gold-tin heat sinks, etc., and is committed to becoming a * metal packaging shell manufacturer, contributing to the realization of domestic core technologies and information security. In 2017, the company led the Shenzhen Science and Technology Innovation Commission * batch science and technology program technical research project "Research and Development of Key Technologies for Ceramic Sealing of High-Power Fiber Lasers" and successfully passed acceptance. In 2020, it cooperated with Hisense Laser on a laser display device packaging shell project, achieving important results such as replacing imports of key components.

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Information is aggregated from the web and may not be exact. For reference only.
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How Fast Is Hiring Growing? (20 open positions)

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?
Growth Rate
2026 vs 2025
  • 2025: Down 27%
  • 2024: Down 13%
  • 2023: Up 77%
  • 2022: Down 34%
Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
Note: How fast is hiring at Shenzhen Honggang Optoelectronic Packaging Technology Joint-stock Co., Ltd. growing? 2025: 35 openings (down 27%), 2024: 48 openings (down 13%), 2023: 55 openings (up 77%), 2022: 31 openings (down 34%), 2021: 47 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

Master's Degree Job Demand Analysis

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N/A
Growth Rate
Master's Hiring by Year: 2025 — same as 2024
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at Shenzhen Honggang Optoelectronic Packaging Technology Joint-stock Co., Ltd. growing? Master's recruitment over the years: 2025: 1 openings (down 27%), 2024: 1 openings (down 13%).

— What Are the Salaries Like? (45 records)

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salary range: 4.5K - 50K, 48.9% of roles pay ¥10-20K
Note: salary statistics are based on 45 salary records from the past year and depend on the job sample. For reference only.
How is the salary at Shenzhen Honggang Optoelectronic Packaging Technology Joint-stock Co., Ltd.?48.9% of positions earn 10-20K, Undergraduate salary: ¥。技工类 average salary ¥15.1K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

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Are salaries high at Shenzhen Honggang Optoelectronic Packaging Technology Joint-stock Co., Ltd.? We provide: 电镀,质量,普工,qe,cnc,销售,品质经理,工艺工程,编程,仓管,保安,包装员,市场,文控,机械工,氧化工程师,流水线,焊工,物料员,研发工程师. Click to view detailed salary analysis by job.

honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Job Category

  • 技工类
    33.3% of total 33.3%
  • 质量管理类
    31.1% of total 31.1%
  • 生物/制药/化工/环保类
    17.8% of total 17.8%
  • 工厂生产类
    13.3% of total 13.3%

Education

  • 大专
    40% of total 40%
  • 本科
    35.6% of total 35.6%
  • 高中
    13.3% of total 13.3%
  • 不限
    11.1% of total 11.1%

Experience

  • 不限
    68.9% of total 68.9%
  • 5-10年
    22.2% of total 22.2%
  • 3-5年
    8.9% of total 8.9%
View Detailed Analysis

What does Shenzhen Honggang Optoelectronic Packaging Technology Joint-stock Co., Ltd. require? Who is Shenzhen Honggang Optoelectronic Packaging Technology Joint-stock Co., Ltd. hiring? recruitment: 技工类占比最多占33.3%,其次是质量管理类占31.1%. What education can get in at ? 大专占比最多占40%,其次是本科占35.6%. Work experience required at ? 不限占比最多占68.9%,其次是5-10年占22.2%. Where are the job locations at ? 深圳占比最多占71.1%,其次是荆州占28.9%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 3,693.3312万(元)
Legal Representative: 李刚
Date Established:
Credit Code: 914403007362785236
Registered Address: 深圳市坪山区龙田街道竹坑社区聚柳路6号C栋一单元长方照明工业厂区101

Partners & Suppliers

采购其金属件用于封装 Source
供应商 光通信器件
采购其陶瓷基板用于封装 Source
供应商 光通信器件
为联特科技提供陶瓷封装 Source
合作客户 光通信器件
为昂纳科技提供封装服务 Source
合作客户 光通信器件
为华工正源提供光组件封装 Source
合作客户 光通信器件

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