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Company Overview

Development Stage

About the Company

杭州芯通半导体技术有限公司是专业从事半导体封装测试的高新科技企业,总投资预计17亿人民币。前期在浙江大学科创中心设立汽车模块的封测试验线,并同时在杭州市富阳区建设5万平方的封测园区。

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How Fast Is Hiring Growing? (1 open positions)

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Year-by-Year Hiring:
Note: How fast is hiring at 杭州芯通半导体技术有限公司 growing? 2025年36个(增长1100%),2024年3个. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

— What Are the Salaries Like? (35 records)

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salary range: 4.5K - 50K, 54.3% of roles pay ¥8-15K
Note: salary statistics are based on 35 salary records from the past year and depend on the job sample. For reference only.
杭州芯通半导体技术有限公司工资待遇怎么样?54.3%的岗位拿8-15K,本科工资¥。与同行业比-26%,工厂生产类平均工资¥8.7K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

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Are salaries high at 杭州芯通半导体技术有限公司? We provide: 领班,人事,检验,行政,质检,pm,可靠性工程师,品质工程,暖通,水处理,测试工程,ehs,ir,会计,保安,动力技术员,封装工程师,操作工,生产技术,电气. Click to view detailed salary analysis by job.

Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Job Category

  • 工厂生产类
    34.3% of total 34.3%
  • 质量管理类
    34.3% of total 34.3%
  • 行政/后勤类
    14.3% of total 14.3%
  • 酒店/餐饮/旅游/服务类
    14.3% of total 14.3%

Education

  • 高中
    34.3% of total 34.3%
  • 本科
    34.3% of total 34.3%
  • 大专
    25.7% of total 25.7%
  • 不限
    5.7% of total 5.7%

Experience

  • 3-5年
    54.3% of total 54.3%
  • 不限
    34.3% of total 34.3%
  • 1-3年
    8.6% of total 8.6%
  • 5-10年
    2.9% of total 2.9%
View Detailed Analysis

What does 杭州芯通半导体技术有限公司 require? Who is 杭州芯通半导体技术有限公司 hiring? 招聘类别工厂生产类占比最多占34.3%,其次是质量管理类占34.3%。什么学历能进?高中占比最多占34.3%,其次是本科占34.3%。工作经验有什么要求?3-5年占比最多占54.3%,其次是不限占34.3%。工作地区在哪?杭州占比最多占100%。 Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 20,000万(元)
Legal Representative: 林忠
Date Established:
Credit Code: 91330183MACP47BX2D
Registered Address: 浙江省杭州市富阳区灵桥镇羊家埭路7号2区第1幢109室(滨富合作区)

Partners & Suppliers

提供半导体测试解决方案 Source
合作客户 半导体封测
提供半导体测试解决方案 Source
合作客户 半导体封测
提供半导体测试解决方案(如探针卡) Source
合作客户 半导体封测

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