杭州芯通半导体技术有限公司是专业从事半导体封装测试的高新科技企业,总投资预计17亿人民币。前期在浙江大学科创中心设立汽车模块的封测试验线,并同时在杭州市富阳区建设5万平方的封测园区。
What does 杭州芯通半导体技术有限公司 require? Who is 杭州芯通半导体技术有限公司 hiring? recruitment: 工厂生产类占比最多占41.2%,其次是质量管理类占29.4%. What education can get in at ? 高中占比最多占47.1%,其次是大专占26.5%. Work experience required at ? 3-5年占比最多占52.9%,其次是不限占35.3%. Where are the job locations at ? 杭州占比最多占100%. Based on job postings from the past year, for reference only.
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