公司成立于2023年1月,我司为半导体封装测试公司,创始团队拥有超过20年的从业经验,致力建设中端半导体封装公司。有净化车间5000平方米,计划建设年产1亿块集成电路及分立器件封装项目,总投资5千万,目前已建成6条产线,主营SOD-123、 SOD-323、SOT-23、SOT-25、SOT-26、SOT-89等封装产品,正在研发3D立体封装、扇出型封装等类目的产品。
What does 岳锝半导体科技(中山)有限公司 require? Who is 岳锝半导体科技(中山)有限公司 hiring? recruitment: 机械/仪器仪表类占比最多占27.3%,其次是工厂生产类占18.2%. What education can get in at ? 高中占比最多占45.5%,其次是初中占18.2%. Work experience required at ? 不限占比最多占63.6%,其次是1-3年占27.3%. Where are the job locations at ? 中山占比最多占100%. Based on job postings from the past year, for reference only.
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