四川德邦新材料有限公司是烟台德邦科技股份有限公司子公司,股票代码688035,公司是一家专业从事高端电子封装材料研发及产业化的*专精特新“小巨人”企业, 主要产品包括集成电路封装材料、智能终端封装材料、新能源应用材料、高端装备应用材料四大类别,广泛应用于晶圆加工、芯片级封装、功率器件封装、板级封装、模组及系统集成封装等不同封装工艺环节和应用场景。
公司是国家集成电路产业基金重点布局的半导体材料生产企业,在国家高层次海外引进人才领衔的核心团队长期钻研下,公司在集成电路封装、智能终端封装、动力电池封装、光伏叠瓦封装等领域实现技术突破,并已在高端电子封装材料领域构建起了完整的研发生产体系并拥有完全自主知识产权。
What does 四川德邦新材料有限公司 require? Who is 四川德邦新材料有限公司 hiring? recruitment: 技工类占比最多占52.4%,其次是工厂生产类占23.8%. What education can get in at ? 不限占比最多占33.3%,其次是高中占28.6%. Work experience required at ? 1-3年占比最多占81%,其次是不限占19%. Where are the job locations at ? 眉山占比最多占100%. Based on job postings from the past year, for reference only.
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