Company Overview

Development Stage

About the Company

2008年以来,无锡尚积半导体科技股份有限公司团队陆续开发了氧化钒薄膜沉积、吸气薄膜沉积等核心技术,打破了国外公司垄断地位,国内市占率>80%。2020年初,应国内某行业头部公司的邀请,自主设计了国产的PVD设备。无锡尚积专注于国产化率较低的薄膜沉积和刻蚀工艺, 继续打破垄断,为用户提供Turnkey Solution,追求创新与卓越。经营地址是无锡市新吴区长江南路35-312号厂房。核心团队为中国早期半导体技术从业者,来自于业内有名的半导体制造公司和国外半导体设备制造商,具备创始人超二十年、其他核心人员平均超十年的半导体行业从业经验。

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尚积半导体 Financing History (1 rounds)

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Pre-IPO
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Market:
  • Deal:

尚积半导体 How Fast Is Hiring Growing? (27 open positions)

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Growth Rate
2026 vs 2025
  • 2025: Up 135%
  • 2024: Up 225%
  • 2023: Up 60%
  • 2022: Up 67%
尚积半导体 Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
尚积半导体 Campus Recruitment & Advanced Degree Talent Demand
Master's 1 Doctorate 1
Note: How fast is hiring at 无锡尚积半导体科技股份有限公司 growing? 尚积半导体2026: 63 openings (up 3%), 2025: 61 openings (up 135%), 2024: 26 openings (up 225%), 2023: 8 openings (up 60%), 2022: 5 openings (up 67%), 2021: 3 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

尚积半导体 Master's Degree Job Demand Analysis

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Growth Rate
2026 vs 2025
  • 2025: Down 29%
  • 2024: Up 600%
尚积半导体 Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 无锡尚积半导体科技股份有限公司 growing? 尚积半导体Master's recruitment over the years: 2025: 5 openings (down 29%), 2024: 7 openings (up 600%), 2023: 1 openings.

尚积半导体 Doctoral Degree Job Demand Analysis

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-75%
Growth Rate
2026 vs 2025
尚积半导体 Doctoral Hiring by Year: 2026 — 3 fewer jobs than 2025
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is doctoral hiring at 无锡尚积半导体科技股份有限公司 growing? 尚积半导体Doctorate recruitment over the years: 2026: 1 openings (down 80%), 2025: 4 openings (down 29%).

尚积半导体 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 无锡尚积半导体科技股份有限公司? Based on an analysis of 尚积半导体's job postings over the past year, "其他(研发和技术类)" demand: 26.1%, "机械/仪器仪表类": 13.6%, "电子/电器/通信技术类": 11.4%, "计算机/网络/技术类": 8%, "生物/制药/化工/环保类": 3.4%, "电气/能源/动力类": 3.4%. For reference only.

尚积半导体 — What Are the Salaries Like? (88 records)

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尚积半导体 Salary Overview
salary range: 4.5K - 50K, 42.1% of roles pay ¥6-10K
Note: salary statistics are based on 88 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 无锡尚积半导体科技股份有限公司?尚积半导体42.1% of positions earn 6-10K, Undergraduate salary: ¥。Wuxi salary ranking: #419,其他(研发和技术类) average salary ¥22.5K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 尚积半导体

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Are salaries high at 无锡尚积半导体科技股份有限公司? We provide: 技术支持,qe,客服,质量,销售,售前,售后,工艺工程,设备工,软件工程,pv,体系专员,助理工程,技术专家,电气,装配,调试,c#,qc,人事. Click to view detailed salary analysis by job.

尚积半导体 honors, qualifications & industry associations

Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Job Category

  • 其他(研发和技术类)
    26.1% of total 26.1%
  • 质量管理类
    20.5% of total 20.5%
  • 客户服务类
    19.3% of total 19.3%
  • 工厂生产类
    18.2% of total 18.2%

Education

  • 本科
    83% of total 83%
  • 大专
    11.4% of total 11.4%
  • 博士
    3.4% of total 3.4%
  • 硕士
    2.3% of total 2.3%

Experience

  • 不限
    38.6% of total 38.6%
  • 1-3年
    27.3% of total 27.3%
  • 5-10年
    18.2% of total 18.2%
  • 3-5年
    15.9% of total 15.9%
View Detailed Analysis

What does 无锡尚积半导体科技股份有限公司 require? Who is 尚积半导体 hiring? 尚积半导体 recruitment: 其他(研发和技术类)占比最多占26.1%,其次是质量管理类占20.5%. What education can get in at 尚积半导体? 本科占比最多占83%,其次是大专占11.4%. High education required at 尚积半导体? 博士占3.4%,硕士占2.3%. Work experience required at 尚积半导体? 不限占比最多占38.6%,其次是1-3年占27.3%. Where are the job locations at 尚积半导体? 无锡占比最多占100%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 2,166.4515万(元)
Legal Representative: 王世宽
Date Established:
Credit Code: 91320214MA26BPEU95
Registered Address: 无锡市新吴区长江南路35-312号厂房

Partners & Suppliers

无锡尚积半导体向华虹半导体供应PECVD/ALD等半导体薄膜沉积设备 Source
合作客户 晶圆代工

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尚积半导体 Competitors (Similar Companies)

“A high-tech integrated circuit chip foundry enterprise”
“光伏、锂电和半导体专业领域知名的智能装备制造商”
“半导体设备制造商”
“Products are 12-inch integrated circuit wafers, applied in PC, Server,”
“高端装备研发商”
“Industry 4.0 smart factory construction”
“Development and manufacturing of semiconductor materials, devices, and”
半导体 光学 图像处理 运动控制
半导体 硅片 分选设备 晶圆
“An advanced wafer-level packaging and testing enterprise for integrate”
半导体 电子设备 电子元件 集成电路/IC
“半导体再制造设备和研磨液供应系统研发商”
智慧交通 微机电系统/MEMS 汽车零部件/配件 工业智能化
“One-stop chip finished product manufacturing service”
自动化 自动控制系统 机电 重工

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