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About the Company

[Summary] 半导体再制造设备和研磨液供应系统研发商

吉姆西半导体科技(无锡)股份有限公司成立于2014年,是一家*的半导体设备平台型公司。公司主要从事各类半导体专用设备和材料的研发、生产、销售以及设备升级改造业务。公司致力于建设平台型半导体设备企业,为国内外上百家晶圆厂和先进封装厂提供数百款定制化的设备及工艺解决方案,有效填补了国内半导体设备供应的空缺。公司先后荣获*高新技术企业、 *专精特新小巨人企业、2023年江苏独角兽企业、江苏省工程技术研究中心、江苏省企业技术中心等多项资质和荣誉称号。

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吉姆西半导体 How Fast Is Hiring Growing? (138 open positions)

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Note: How fast is hiring at 吉姆西半导体科技(无锡)股份有限公司 growing? 吉姆西半导体2026: 209 openings (up 41%), 2025: 148 openings (down 9%), 2024: 162 openings (up 91%), 2023: 85 openings (up 193%), 2022: 29 openings (down 72%), 2021: 104 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

吉姆西半导体 Master's Degree Job Demand Analysis

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Growth Rate
2026 vs 2025
  • 2025: Down 33%
  • 2024: Up 100%
吉姆西半导体 Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 吉姆西半导体科技(无锡)股份有限公司 growing? 吉姆西半导体Master's recruitment over the years: 2025: 4 openings (down 33%), 2024: 6 openings (up 100%), 2023: 3 openings.

吉姆西半导体 Doctoral Degree Job Demand Analysis

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+100%
Growth Rate
2026 vs 2025
  • 2025: Down 75%
  • 2024: Down 33%
吉姆西半导体 Doctoral Hiring by Year: 2026 — 1 more jobs than 2025
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is doctoral hiring at 吉姆西半导体科技(无锡)股份有限公司 growing? 吉姆西半导体Doctorate recruitment over the years: 2026: 2 openings (up 100%), 2025: 1 openings (down 75%), 2024: 4 openings (down 33%), 2023: 6 openings.

吉姆西半导体 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 吉姆西半导体科技(无锡)股份有限公司? Based on an analysis of 吉姆西半导体's job postings over the past year, "机械/仪器仪表类" demand: 23.4%, "电气/能源/动力类": 11.4%, "电子/电器/通信技术类": 9.7%, "其他(研发和技术类)": 8.4%, "生物/制药/化工/环保类": 8%, "计算机/网络/技术类": 6.7%. For reference only.

吉姆西半导体 — What Are the Salaries Like? (299 records)

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吉姆西半导体 Salary Overview
salary range: 3K - 50K, 50.2% of roles pay ¥6-10K
Note: salary statistics are based on 299 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 吉姆西半导体科技(无锡)股份有限公司?吉姆西半导体50.2% of positions earn 6-10K, Undergraduate salary: ¥。机械/仪器仪表类 average salary ¥12.6K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 吉姆西半导体

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Are salaries high at 吉姆西半导体科技(无锡)股份有限公司? We provide: 设备工,电气,质量,装配,pm,工艺工程,实习生,采购,qe,售后,销售,人事,机械工,会计,研发工程师,机械研发,pv,ba,仓库,化学. Click to view detailed salary analysis by job.

吉姆西半导体 honors, qualifications & industry associations

吉姆西半导体 Related Industry Tags

Job Category

  • 机械/仪器仪表类
    23.4% of total 23.4%
  • 技工类
    20.4% of total 20.4%
  • 工厂生产类
    19.1% of total 19.1%
  • 质量管理类
    15.1% of total 15.1%

Education

  • 本科
    47.5% of total 47.5%
  • 大专
    40.1% of total 40.1%
  • 高中
    7.7% of total 7.7%
  • 硕士
    2% of total 2%

Experience

  • 不限
    64.2% of total 64.2%
  • 1-3年
    16.7% of total 16.7%
  • 3-5年
    13.7% of total 13.7%
  • 5-10年
    5.4% of total 5.4%
View Detailed Analysis

What does 吉姆西半导体科技(无锡)股份有限公司 require? Who is 吉姆西半导体 hiring? 吉姆西半导体 recruitment: 机械/仪器仪表类占比最多占23.4%,其次是技工类占20.4%. What education can get in at 吉姆西半导体? 本科占比最多占47.5%,其次是大专占40.1%. High education required at 吉姆西半导体? 硕士占2%,博士占1%. Work experience required at 吉姆西半导体? 不限占比最多占64.2%,其次是1-3年占16.7%. Where are the job locations at 吉姆西半导体? 无锡占比最多占62.9%,其次是上海占21.1%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 36,715.6957万(元)
Legal Representative: 庞金明
Date Established:
Credit Code: 91320205310580012Q
Registered Address: 无锡市锡山区锡北镇泾祥路1号

Partners & Suppliers

与清华大学摩擦学国家重点实验室合作研发CMP技术 Source
供应商 高校/研究院
吉姆西CMP设备用于长鑫存储的DRAM制造 Source
合作客户 半导体存储
吉姆西为长江存储提供CMP设备和再生晶圆 Source
合作客户 半导体存储
吉姆西CMP设备导入积塔半导体生产线 Source
合作客户 半导体晶圆代工
吉姆西向华虹半导体提供CMP设备及工艺支持 Source
合作客户 半导体晶圆代工

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吉姆西半导体 Competitors (Similar Companies)

“A high-tech integrated circuit chip foundry enterprise”
“光伏、锂电和半导体专业领域知名的智能装备制造商”
“An advanced wafer-level packaging and testing enterprise for integrate”
“Industry 4.0 smart factory construction”
电子系统工程 电子系统 生产 制造
“Products are 12-inch integrated circuit wafers, applied in PC, Server,”
“Leading provider of comprehensive solutions in the field of intelligen”
“高端装备研发商”
“Microelectronics Industry Group”
“New energy vehicle manufacturer”
“Dreams lead the future”
“Invented for life”
“High-tech enterprise specializing in the development of uncooled infra”
“A provider of video-centric intelligent IoT solutions and big data ser”
“半导体设备制造商”

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