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Company Overview

Development Stage

About the Company

成都巴普科技有限公司,致力于专业制作半导体各类刀具、模具以及Die Bond和Wire Bond的夹具等精密加工件。并大力拓展、创新,增加我们的产品类型,其目的主要是为了更好的为全国甚至国外客户服务。 公司坐落于四川省成都市高新区,成都高新区是*高新技术产业开发区 、国家自主创新示范区 、全国版权示范园区 、全国科技和金融结合试点地区 、国家知识产权示范园区 、国家高新技术产业标准化示范区 、全国知名品牌创建示范区,亦是四川天府新区重点区域。公司现有员工30人,研发6人,生产18人,质量2人,销售和管理4人。其中研究生3名,本科生5名,大专生8,平均年龄32岁。团队整体比较年轻,充满活力;主要致力于发展和开发半导体封装的前段设备配件和消耗品以及封装模具、切筋刀具等机械精密加工,以及各类设备的上下料以及自动化改造。

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Recruitment Overview / Current Status (3 open positions)

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Note: How fast is hiring at 成都巴普科技有限公司 growing? . A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

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Business Registration

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Operating Status: 开业
Registered Capital: 500万(元)
Legal Representative: 杨建军
Date Established:
Credit Code: 91510100MA7KT1JF2A
Registered Address: 成都高新区新创路28号4幢

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