芯辰(重庆)微电子于2021年2月5日在重庆高新区注册成立,基于"电子科技大学模数混合及S0C芯片设计中心"、“电子科技大学重庆微电子产业技术研究院"多年的技术积淀、人才储备及产业化能力,深耕于模数混合芯片(尤其是ADC芯片)和专用SoC芯片十年磨一剑,发力于国产化替换及应用,公司产品技术实力*,综合性能达到国际竞品水平。
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