Nanfei Microelectronics

Nanfei Microelectronics Co., Ltd. is headquartered in the Shenzhen High-tech Park. Nanfei Microelectronics is an innovation-driven elite enterprise. For more than ten years, it has been professionally engaged in the R&D, production, sales and service of integrated circuits for data center interconnect, network communications and intelligent IoT. Its products cover HPC, routing, switching, IoT and other fields, and it can provide operators, enterprises and consumers with competitive comprehensive solutions and services.
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The company has R&D and production facilities in Shenzhen, Chengdu, Changsha and Changzhou. It is one of the very few enterprises in China that has simultaneously mastered the system architecture of general Ethernet and data center switching chips, core routing, hardware architecture of switching equipment, communication protocol stacks, and the related chip design and mass production capabilities. The company has core technologies in data center interconnect, data center converged networks, low-latency high-order switching networks, network processors, Ethernet switching, high-speed IO and intelligent IoT chips. From 90nm to 14nm processes, the company has launched multiple product series and mass-produced more than ten chips, strongly advancing the development of China's high-end network communication chips.

Nanfei has always adhered to the philosophy of "cooperation, openness and win-win," applying professional experience in network communications, data center interconnect and integrated circuits to provide society with innovative, customized products and services, thereby helping people bridge the digital divide and create a freer and more comfortable future life.


Corporate History
—— In 2018, 14nm process, 10Tbps-class high-order, high-speed, low-latency switching interconnect chipset, supporting 25G/50G/100G/200G/400G Ethernet switching and PCIE4.0 access. 55nm process, a more highly integrated Macbee/BLE multimode intelligent IoT SOC chip.

—— In 2017, 28nm process, the Groot series 640Gbps high-density 10GbE and 40GbE Ethernet switching chips, used for aggregation, core layer and data center switches; 200Gbps Gigabit Ethernet switching chips, used for access and aggregation layer switches.

—— In 2016, Macbee ultra-low-power, low-cost wireless intelligent network chips, covering the smart home and IoT industry markets such as lighting, security, electrical, home appliances and electromechanical.

—— In 2015, successful 28nm tape-out of the 3.4Tbps Galaxy-Fabric/NIC converged network chipset, providing high-speed xFabric, 100G Ethernet and PCIE3.0 switching and access capabilities, and being the first in the industry to realize a set of network connections for computing, storage, IO and network nodes.

—— In 2014, mass production of the 28nm Galaxy-III interconnect switching chipset, with a single-chip switching capacity of 7.2Tbps, which has been deployed on a large scale in data center clusters and routers.

—— In 2013, mass production of the 45nm Galaxy-II interconnect switching chipset, with a single-port rate of 112G, which has been widely used in the core Fabric field of data center clusters and routers.

—— In 2009, launch of the 90nm Galaxy-I interconnect switching chipset, with a single-port rate of 80G, supporting RDMA offload and flattened switching, and a port rate twice that of the then *fastest commercial network Infiniband.

—— In 2007, the Microelectronics Division was established to vigorously develop the network interconnect integrated circuit chip business.