Company Overview

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About the Company

[Summary] 产品研发及工程解决方案服务商

公司简介:
苏州同元软控信息技术有限公司成立于2008年,总部位于苏州市工业园区,是为装备制造业提供新一代系统级设计与仿真验证工业软件产品研发、工程服务及整体解决方案的高科技企业。同元软控的产品和服务已经广泛应用于航天、航空、能源、车辆、船舶、教育等行业,为国家系列重大工程提供了数字化设计支撑。
苏州同元经过团队20年技术积累、公司12年持续研发,全面掌握了自CAD、CAE之后的新一代数字化核心技术——多领域统一建模与仿真技术,采用国际多领域统一建模规范Modelica,形成目前核心产品——系统设计与仿真验证平台MWorks。MWorks支持基于模型的系统设计、仿真验证、模型集成、虚拟试验、运动维护以及协同研发。MWorks是完全自主的系统仿真软件,完全自主研发的内核是国际上六个商品化Modelica编译求解引擎之一,并已为国际知名汽车工业软件供应商提供内核授权,整体水平位居国际前列。
依托于完全自主的系统设计与仿真验证平台MWorks,已经实现或正在实现对一系列国内空白的设计仿真软件的替代,包括系统仿真软件、科学工程计算与建模仿真软件等平台软件,机械多体仿真分析软件、一维流体仿真分析软件、电气仿真分析软件等专业软件,以及航天、航空、核能、汽车等行业仿真软件。

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同元软控 Financing History (2 rounds)

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A轮
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 融资金额未公开
  • Investor: 中网投,钟鼎资本,元禾控股...

同元软控 How Fast Is Hiring Growing? (97 open positions)

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Note: How fast is hiring at 苏州同元软控技术股份有限公司 growing? 同元软控2026: 245 openings (up 18%), 2025: 207 openings (up 78%), 2024: 116 openings (down 35%), 2023: 179 openings (down 31%), 2022: 258 openings (down 22%), 2021: 332 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

同元软控 Master's Degree Job Demand Analysis

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How fast is master's hiring at 苏州同元软控技术股份有限公司 growing? 同元软控Master's recruitment over the years: 2025: 62 openings (up 82%), 2024: 34 openings (down 32%), 2023: 50 openings (down 53%), 2022: 107 openings (down 36%), 2021: 167 openings.

同元软控 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 苏州同元软控技术股份有限公司? Based on an analysis of 同元软控's job postings over the past year, "计算机/网络/技术类" demand: 64.5%, "电子/电器/通信技术类": 36.5%, "电气/能源/动力类": 23.5%, "机械/仪器仪表类": 16.6%, "其他(研发和技术类)": 4.9%, "美术/设计/创意类": 0.7%. For reference only.

同元软控 — What Are the Salaries Like? (307 records)

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salary range: 3K - 50K, 66.7% of roles pay ¥20-50K
Note: salary statistics are based on 307 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 苏州同元软控技术股份有限公司?同元软控66.7% of positions earn 20-50K, Fresh graduate salary: ¥10.9K。Suzhou salary ranking top 30,计算机/网络/技术类 average salary ¥24.1K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 同元软控

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Are salaries high at 苏州同元软控技术股份有限公司? We provide: 建模,开发工程师,仿真工程师,售前,实习生,解决方案,销售,电气,c++,bd,编译器开发,方案经理,算法,行政,信息,方案工程师,软件开发,java,引擎开发,fpga. Click to view detailed salary analysis by job.

同元软控 honors, qualifications & industry associations

同元软控 Related Industry Tags

Job Category

  • 计算机/网络/技术类
    63.9% of total 63.9%
  • 销售类
    37.4% of total 37.4%
  • 电子/电器/通信技术类
    36.1% of total 36.1%
  • 电气/能源/动力类
    23.2% of total 23.2%

Education

  • 本科
    50.3% of total 50.3%
  • 硕士
    38.7% of total 38.7%
  • 不限
    9.7% of total 9.7%
  • 大专
    1.3% of total 1.3%

Experience

  • 3-5年
    33.5% of total 33.5%
  • 不限
    22.9% of total 22.9%
  • 5-10年
    17.1% of total 17.1%
  • 1-3年
    15.2% of total 15.2%
View Detailed Analysis

What does 苏州同元软控技术股份有限公司 require? Who is 同元软控 hiring? 同元软控 recruitment: 计算机/网络/技术类占比最多占63.9%,其次是销售类占37.4%. What education can get in at 同元软控? 本科占比最多占50.3%,其次是硕士占38.7%. High education required at 同元软控? 硕士占38.7%. Work experience required at 同元软控? 3-5年占比最多占33.5%,其次是不限占22.9%. Where are the job locations at 同元软控? 苏州占比最多占24.8%,其次是武汉占16.5%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 2,166.6667万(元)
Legal Representative: 周凡利
Date Established:
Credit Code: 913205946608240050
Registered Address: 苏州工业园区淞北路333号D1幢

Partners & Suppliers

合作航空发动机系统仿真建模 Source
合作客户 高校/研究院
共建联合实验室,开发复杂系统仿真应用 Source
合作客户 高校/研究院
合作进行系统仿真教学与科研平台建设 Source
合作客户 高校/研究院
联合开展多领域物理建模与仿真技术研究 Source
合作客户 高校/研究院
联合开展机电液联合仿真技术研究 Source
合作客户 高校/研究院

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数据服务 数字化解决方案 MBSE 系统仿真

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