Company Overview

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About the Company

[Summary] 先进电子级半导体薄膜材料研发商

安徽安德科铭半导体科技股份有限公司,公司2018年成立,总部位于安徽省合肥经济技术开发区,是专注于先进电子级半导体薄膜前驱体材料研发、生产与销售的专精特新“小巨人”企业,聚焦电子专用材料细分领域,以核心技术突破补齐产业链关键环节短板。
公司构建多区域协同发展布局:合肥研发基地负责产品线规划、新产品新工艺开发,以及未来业务方向开拓;铜陵已投产及合肥正筹建的产业化基地,承担技术成果转化和前驱体材料规模化生产与供应;上海、武汉等地的销售及市场开发中心,则肩负客户服务、需求响应、业务开拓等多重职能。
公司凭借自主知识产权与先进半导体材料制造技术,填补国内相关领域技术空白,获评专精特新“小巨人”企业。合肥研发、铜陵产业化主体均为国家高新技术企业,拥有省级技术研发平台、省级专精特新中小企业等资质,获评安徽省战略新兴产业基地、安徽省数字化车间、合肥市重点集成电路企业等称号,已完成多项国家、省、市级科技研发项目。
公司以海归人才和安徽省高层次人才团队为核心架构的研发生产队伍,获安徽省115产业创新团队称号。研发团队具备分子材料开发提纯、半导体器件制造工艺及应用落地能力,可精准对接用户需求开展研发;与高校共建研究生联合培养平台,开展人才培育工作。公司坚持自主创新,累计研发产品百余款,多款获安徽省首批次新材料认定,技术达国际先进水平且实现自主供应;累计申请专利百余项,发明专利占比过半,多项主营业务核心知识产权已获授权;主导制定国际标准、参与多项国家标准编制,构建覆盖全链条的知识产权保护体系。

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安德科铭 Financing History (6 rounds)

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战略投资
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 融资金额未公开
  • Investor: 中化资本

安德科铭 How Fast Is Hiring Growing? (50 open positions)

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Note: How fast is hiring at 安徽安德科铭半导体科技股份有限公司 growing? 安德科铭2025: 55 openings (up 45%), 2024: 38 openings (up 73%), 2023: 22 openings (down 33%), 2022: 33 openings (down 28%), 2021: 46 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

安德科铭 Master's Degree Job Demand Analysis

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Growth Rate
2026 vs 2025
  • 2025: Down 43%
  • 2024: Up 40%
  • 2023: Up 67%
  • 2022: Up 50%
安德科铭 Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 安徽安德科铭半导体科技股份有限公司 growing? 安德科铭Master's recruitment over the years: 2025: 4 openings (down 43%), 2024: 7 openings (up 40%), 2023: 5 openings (up 67%), 2022: 3 openings (up 50%), 2021: 2 openings.

安德科铭 Doctoral Degree Job Demand Analysis

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-33%
Growth Rate
2026 vs 2025
  • 2025: Up 50%
  • 2024: Down 33%
  • 2023: Up 50%
  • 2022: Up 100%
安德科铭 Doctoral Hiring by Year: 2026 — 1 fewer jobs than 2025
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is doctoral hiring at 安徽安德科铭半导体科技股份有限公司 growing? 安德科铭Doctorate recruitment over the years: 2026: 2 openings (down 33%), 2025: 3 openings (up 50%), 2024: 2 openings (down 33%), 2023: 3 openings (up 50%), 2022: 2 openings (up 100%), 2021: 1 openings.

安德科铭 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 安徽安德科铭半导体科技股份有限公司? Based on an analysis of 安德科铭's job postings over the past year, "其他(研发和技术类)" demand: 20.8%, "生物/制药/化工/环保类": 8.8%, "计算机/网络/技术类": 5.6%, "机械/仪器仪表类": 4.8%, "电气/能源/动力类": 4%, "电子/电器/通信技术类": 3.2%. For reference only.

安德科铭 — What Are the Salaries Like? (125 records)

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安德科铭 Salary Overview
salary range: 4.5K - 50K, 65.6% of roles pay ¥10-50K以上
Note: salary statistics are based on 125 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 安徽安德科铭半导体科技股份有限公司?安德科铭65.6% of positions earn 10-50K以上, Undergraduate salary: ¥。Hefei salary ranking top 30,销售类 average salary ¥35.4K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 安德科铭

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Are salaries high at 安徽安德科铭半导体科技股份有限公司? We provide: bd,工艺工程,拓展,研发工程师,质量,客户经理,qc,产品经理,副总,机械工,分析,研发经理,销售,大客户,电气,行政,qa,qe,业务专员,会计. Click to view detailed salary analysis by job.

安德科铭 honors, qualifications & industry associations

安德科铭 Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Job Category

  • 销售类
    25.6% of total 25.6%
  • 工厂生产类
    23.2% of total 23.2%
  • 经营管理类
    22.4% of total 22.4%
  • 其他(研发和技术类)
    20.8% of total 20.8%

Education

  • 本科
    63.2% of total 63.2%
  • 大专
    19.2% of total 19.2%
  • 硕士
    12.8% of total 12.8%
  • 博士
    4% of total 4%

Experience

  • 不限
    39.2% of total 39.2%
  • 3-5年
    35.2% of total 35.2%
  • 1-3年
    20.8% of total 20.8%
  • 5-10年
    4.8% of total 4.8%
View Detailed Analysis

What does 安徽安德科铭半导体科技股份有限公司 require? Who is 安德科铭 hiring? 安德科铭 recruitment: 销售类占比最多占25.6%,其次是工厂生产类占23.2%. What education can get in at 安德科铭? 本科占比最多占63.2%,其次是大专占19.2%. High education required at 安德科铭? 硕士占12.8%,博士占4%. Work experience required at 安德科铭? 不限占比最多占39.2%,其次是3-5年占35.2%. Where are the job locations at 安德科铭? 合肥占比最多占83.2%,其次是上海占4%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 1,448.3906万(元)
Legal Representative: 汪穹宇
Date Established:
Credit Code: 91340103MA2RQWYY92
Registered Address: 安徽省合肥市合肥经济技术开发区高刘街道新桥科创示范区硕放路1号新桥集成电路科技园研发楼206-1室

Partners & Suppliers

采购特种气体 Source
供应商 芯片制造
采购高纯气体原料 Source
供应商 芯片制造
提供刻蚀气体等材料 Source
合作客户 芯片制造
供应电子特气及前驱体 Source
合作客户 芯片制造
提供半导体高纯化学材料 Source
合作客户 芯片制造

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功能薄膜 膜材料 薄膜 电子材料
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集成电路封装测试 集成电路封装 芯片封装 半导体
“导体制先电子化学材料的研发和应用”
半导体 新材料 配件 导体材料
“Empowering the information society with storage technology, improving ”
半导体 硬件 无尘洁净室 清洗设备
“TBEA is a service provider of solutions for global energy industry”
“精细磷酸盐生产”
“New energy vehicle manufacturer”
新材料 聚乙烯/PE 化工/化学 塑料合金
精密机械零部件 机械零部件 生产 机械五金加工
服装/服饰 纺织 丝绸 化纤面料
工程设计 建筑幕墙 机电设备安装 门窗

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