Company Overview

Development Stage

  • Stage: 股权融资, 3.19亿人民币。
  • Honors: 省级专精特新中小企业 科技型中小企业 According to algorithm
  • News: 2022-02-21:高端模拟芯片企业“天易合芯”完成数亿元c轮融资。
  • Salary: 97.2% of positions earn 8-50K, In 2026 vs last yeargrew by 29%.。Master's salary: ¥41.0K.
  • R&D: "其他(研发和技术类)" demand: 44.4%, "电子/电器/通信技术类": 41.7%, "计算机/网络/技术类": 19.4%。
  • Recruiting: In 2026 vs 2025decreased by 17%. Demand for highly educated talent: Master's: 2.
  • Requirement: Education: 本科 leads with 66.7%. Experience: 不限 leads with 52.8%.
  • Region: Distributed across 2 regions, 南京: 47.2%, 上海: 22.2%, 天津: 8.3%, 哈尔滨: 8.3%.

About the Company

[Summary] 高性能模拟集成电路设计

Information is aggregated from the web and may not be exact. For reference only.
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天易合芯 Financing History (5 rounds)

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股权融资
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Amount: 3.19亿人民币
  • Investor: 杰华特

天易合芯 How Fast Is Hiring Growing? (5 open positions)

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?
Growth Rate
2026 vs 2025
  • 2025: Flat 0%-
  • 2024: Down 41%
  • 2023: Down 9%
  • 2022: Up 69%
天易合芯 Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
天易合芯 Campus Recruitment & Advanced Degree Talent Demand
Master's 2
Note: How fast is hiring at 江苏天易合芯电子有限公司 growing? 天易合芯2026: 24 openings (down 17%), 2025: 29 openings (flat), 2024: 29 openings (down 41%), 2023: 49 openings (down 9%), 2022: 54 openings (up 69%), 2021: 32 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

天易合芯 Master's Degree Job Demand Analysis

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?
Growth Rate
2026 vs 2025
  • 2025: Up 33%
  • 2024: Down 57%
  • 2023: Up 133%
  • 2022: Up 200%
天易合芯 Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 江苏天易合芯电子有限公司 growing? 天易合芯Master's recruitment over the years: 2025: 4 openings (up 33%), 2024: 3 openings (down 57%), 2023: 7 openings (up 133%), 2022: 3 openings (up 200%), 2021: 1 openings.

天易合芯 R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 江苏天易合芯电子有限公司? Based on an analysis of 天易合芯's job postings over the past year, "其他(研发和技术类)" demand: 44.4%, "电子/电器/通信技术类": 41.7%, "计算机/网络/技术类": 19.4%. For reference only.

天易合芯 — What Are the Salaries Like? (36 records)

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天易合芯 Salary Overview
salary range: 8K - 50K, 97.2% of roles pay ¥8-50K
Note: salary statistics are based on 36 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 江苏天易合芯电子有限公司?天易合芯97.2% of positions earn 8-50K, Undergraduate salary: ¥。Yancheng salary ranking top 5,其他(研发和技术类) average salary ¥34.9K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of 天易合芯

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Are salaries high at 江苏天易合芯电子有限公司? We provide: 设计工程师,ic设计,应用工程师,算法,产品工程,模拟ic,销售,大客户,pe,测试工程,ae,fa,fpga,te,嵌入式,版图工程师,软件开发,项目经理,驱动开发. Click to view detailed salary analysis by job.

天易合芯 honors, qualifications & industry associations

天易合芯 Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Job Category

  • 其他(研发和技术类)
    44.4% of total 44.4%
  • 电子/电器/通信技术类
    41.7% of total 41.7%
  • 计算机/网络/技术类
    19.4% of total 19.4%
  • 技工类
    11.1% of total 11.1%

Education

  • 本科
    66.7% of total 66.7%
  • 硕士
    27.8% of total 27.8%
  • 大专
    5.6% of total 5.6%

Experience

  • 不限
    52.8% of total 52.8%
  • 3-5年
    27.8% of total 27.8%
  • 1-3年
    11.1% of total 11.1%
  • 5-10年
    8.3% of total 8.3%
View Detailed Analysis

What does 江苏天易合芯电子有限公司 require? Who is 天易合芯 hiring? 天易合芯 recruitment: 其他(研发和技术类)占比最多占44.4%,其次是电子/电器/通信技术类占41.7%. What education can get in at 天易合芯? 本科占比最多占66.7%,其次是硕士占27.8%. High education required at 天易合芯? 硕士占27.8%. Work experience required at 天易合芯? 不限占比最多占52.8%,其次是3-5年占27.8%. Where are the job locations at 天易合芯? 南京占比最多占47.2%,其次是上海占22.2%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 1,556.0686万(元)
Legal Representative: ZHOU XUNWEI(周逊伟)
Date Established:
Credit Code: 91320111302494878U
Registered Address: 盐城市盐都区潘黄街道人工智能港B6号楼C区9层

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