江苏天易合芯电子有限公司 R&D strength - Jobui

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天易合芯 R&D strength (tech talent demand and pay)

What is the demand for tech talent at 天易合芯? Based on job postings in the past year, “其他（研发和技术类）”占44.7%，“电子/电器/通信技术类”占39.5%，“计算机/网络/技术类”占21.1%，“机械/仪器仪表类”占2.6%. For reference only.

其他（研发和技术类） salary: 88.2% of positions pay ¥15-50K/month

5.9% 8-10K 17.6% 15-20K 5.9% 20-30K 64.7% 30-50K 5.9% 50K以上

其他（研发和技术类） talent demand: 17 positions, 44.7%, hot jobs:

Master's degree job demand analysis at 天易合芯 (More)

2025: Up 33%
2024: Down 57%
2023: Up 133%
2022: Up 200%

天易合芯 master's hiring over the years:

2021 1 positions 2022 3 positions 2023 7 positions 2024 3 positions 2025 4 positions 2026 ? *** 

* Hiring volume was generally low in 2020-2022 due to the pandemic

Master's salary 򀀩

天易合芯 honors, qualifications & industry associations

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Tags are labelled based on keyword text matching analysis and may be related to the company. For reference only.

Talent Demand Trend Analysis More

模拟芯片 +300%

模拟电路芯片 +300%

处理器芯片 +72%

存储产品 +80%

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