Company Overview

Development Stage

About the Company

长春永固科技有限公司成立于2007年。秉承着“赢在品质、志在卓越”的企业理念,怀揣着打造国内电子材料*品牌的愿景,以好学、自信、踏实、严谨的工作作风。经过十多年的开拓进取、技术创新,已发展成为集研发、生产、销售胶膜、导电胶、绝缘胶的高端制造商。产品覆盖半导体封装、LED、智能手机、光伏、智能卡等领域。 永固科技在多项产品上实现国内首次技术创新,大部分产品技术水平达到国际先进水平或*水平,打破了国外企业对我国高端电子封装材料市场的垄断,填补了我国在高端芯片封装材料领域的空白,树立起民族品牌。永固科技已成为电子封装材料产业链——芯片粘接剂细分市场的国内*品牌、技术创新能力和盈利能力*强的国内龙头企业。 公司的研发团队由大学教授、留美博士、博士、硕士等组成,多人均为科技部、吉林省科技发展计划项目负责人。迄今为止,申报专利21项,现已获得授权发明专利6项、实用新型专利5项,其中1项发明专利获吉林省第二届专利优秀奖。 人才是永固科技可持续发展的坚实力量,在这里员工得到充分的尊重与良好的工作氛围。因此,我们需要更多专业、积极、乐于学习的员工加入,与企业共同成长。 *专精特新“小巨人”企业 参与制订国家标准《各向同性导电胶粘剂试验方法 *部分:通用方法》已于2018年颁布实施 研发团队参与制订国家标准《胶粘剂挥发性有机化合物限量》已于2020年颁布实施 研发团队主持制定的行业标准《导电胶粘剂》已于2022年4月1日开始实施 2017年第六届创新创业大赛吉林赛区一等奖,第六届创新创业大赛全国行业赛新材料组二等奖 2019年创客中国吉林省中小企业创新创业大赛总决赛“企业组一等奖” 承担国家发改委、国家科技重大专项子课题、科技部、省科技厅、市科技局等多类别发展计划

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Information is aggregated from the web and may not be exact. For reference only.
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How Fast Is Hiring Growing? (17 open positions)

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Note: How fast is hiring at 长春永固科技有限公司 growing? 2025: 59 openings (up 16%), 2024: 51 openings (up 96%), 2023: 26 openings (up 420%), 2022: 5 openings (down 67%), 2021: 15 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

Master's Degree Job Demand Analysis

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?
Growth Rate
2026 vs 2025
  • 2025: Down 11%
  • 2024: Up 13%
  • 2023: Up 700%
Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at 长春永固科技有限公司 growing? Master's recruitment over the years: 2025: 8 openings (down 11%), 2024: 9 openings (up 13%), 2023: 8 openings (up 700%), 2022: 1 openings.

Doctoral Degree Job Demand Analysis

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-33%
Growth Rate
2026 vs 2025
  • 2025: Up 50%
  • 2024: Down 14%
  • 2023: Up 600%
  • 2022: Flat 0%-
Doctoral Hiring by Year: 2026 — 3 fewer jobs than 2025
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is doctoral hiring at 长春永固科技有限公司 growing? Doctorate recruitment over the years: 2026: 6 openings (down 33%), 2025: 9 openings (up 50%), 2024: 6 openings (down 14%), 2023: 7 openings (up 600%), 2022: 1 openings (flat), 2021: 1 openings.

R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at 长春永固科技有限公司? Based on an analysis of 's job postings over the past year, "其他(研发和技术类)" demand: 24.5%, "生物/制药/化工/环保类": 18.9%, "机械/仪器仪表类": 5.7%, "科研类": 3.8%, "计算机/网络/技术类": 1.9%. For reference only.

— What Are the Salaries Like? (53 records)

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salary range: 3K - 50K, 60.4% of roles pay ¥10-50K
Note: salary statistics are based on 53 salary records from the past year and depend on the job sample. For reference only.
How is the salary at 长春永固科技有限公司?60.4% of positions earn 10-50K, Undergraduate salary: ¥。Changchun salary ranking top 5,其他(研发和技术类) average salary ¥19.7K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of

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Are salaries high at 长春永固科技有限公司? We provide: 化学,研发主管,财务,bd,研发员,实验员,客服,研发工程师,中心主任,会计,出纳,总账,设备工,质量,ehs,qe,安全,工艺工程,总经办主任,技术服务. Click to view detailed salary analysis by job.

honors, qualifications & industry associations

Related Industry Tags

Job Category

  • 其他(研发和技术类)
    24.5% of total 24.5%
  • 经营管理类
    24.5% of total 24.5%
  • 生物/制药/化工/环保类
    18.9% of total 18.9%
  • 财务/审计/统计类
    17% of total 17%

Education

  • 本科
    52.8% of total 52.8%
  • 硕士
    20.8% of total 20.8%
  • 博士
    17% of total 17%
  • 大专
    7.5% of total 7.5%

Experience

  • 不限
    41.5% of total 41.5%
  • 3-5年
    32.1% of total 32.1%
  • 1-3年
    15.1% of total 15.1%
  • 5-10年
    11.3% of total 11.3%
View Detailed Analysis

What does 长春永固科技有限公司 require? Who is 长春永固科技有限公司 hiring? recruitment: 其他(研发和技术类)占比最多占24.5%,其次是经营管理类占24.5%. What education can get in at ? 本科占比最多占52.8%,其次是硕士占20.8%. High education required at ? 硕士占20.8%,博士占17%. Work experience required at ? 不限占比最多占41.5%,其次是3-5年占32.1%. Where are the job locations at ? 长春占比最多占84.9%,其次是上海占11.3%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 2,777.7778万(元)
Legal Representative: 赵柏杨
Date Established:
Credit Code: 91220101661607168A
Registered Address: 吉林省长春市北湖科技开发区中盛路2620号

Partners & Suppliers

采购长春永固LED封装胶 Source
合作客户 LED封装
采购长春永固导电银胶用于LED封装 Source
合作客户 LED封装
采购长春永固封装材料 Source
合作客户 芯片封测
采购长春永固芯片贴装胶 Source
合作客户 芯片封测
采购长春永固导电胶用于芯片封装 Source
合作客户 芯片封测

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