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Company Overview

About the Company

TSP是超精密电子部品行业,设计及加工半导体用引线框架及电镀,超精密模具,专门制作半导体用设备,并进军世界。
公司于1985年设立以后,即使在急剧变化的世界环境里也成就了良好的销售业绩,及海外市场扩大等方面的成长,通过确保新技术、开拓新事业。从半导体部品专业公司发展成为可提供半导体组装工程所需要的设备。以及提供半导体生产相关的Total Solution的专业公司。
TSP保证会以World Top技术创造未来而作不断努力,为了中型企业IT产业的发展将努力起到带头作用。

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Business Registration

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Operating Status: 开业
Registered Capital: 6,502.8296万(元)
Legal Representative: 黄宏新
Date Established:
Credit Code: 91320214739441752L
Registered Address: 无锡市新吴区新达路28-1

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