Dewo Advanced

Shenzhen Dewo Advanced Automation Co., Ltd. was established in 2012, focusing on independent research and development, production, and sales of ultra-high-end semiconductor packaging equipment and precision electronic equipment, committed to providing world-class products for customers in high-end equipment fields such as semiconductor IC packaging, LED packaging, and high-precision electronic equipment. ● The company is located in Bao'an District, Shenzhen, with a subsidiary in Suzhou. ● National High-tech Enterprise, Shenzhen "Specialized, Refined, Distinctive, and Innovative" SME. ● Focused on the R&D, production, and sales of high-end semiconductor equipment, with the main product being semiconductor wire bonders. Customers are spread across more than 20 provinces and autonomous regions nationwide, with annual sales exceeding 100 million. ● Independently developed trajectory ultra-high-speed synchronous motion control system, independent visual algorithms, ultra-high-speed motor and drive algorithms, precise ultrasonic ignition system, and high-speed synchronization and coordination algorithms among various systems. All core technologies are at the international advanced level. ● R&D-oriented enterprise, with core management from Huawei Electric system and Harbin Institute of Technology highly educated and highly skilled talents, R&D personnel accounting for 30%. ● In 2022, funded by the Shenzhen Science and Technology Innovation Commission's "Enlisting and Leading" key technical research project. ● Honors and awards include Gaogong Golden Globe Award 2021 Fast-growing Enterprise, Gaogong LED 2022 "Display Industry TOP50—Production Equipment TOP10", etc.