主营智能手环,无线充电器,U盘,2005年U盘出现了黑胶体封装,使U盘做到超小超薄,但技术限于台湾,对于全世界U盘*主要生产基地的深圳是望尘莫及,艾可尔公司过硬的开发实力,经过多次实践,创造了芯片切割技术,***在中国大陆研发出超薄超小U盘,与台湾黑胶体形成了对立,展示出切割技术生产灵活,质量自控的优点,通过这次成功,艾可尔公司将在未来开发无数超小超薄的U盘产品,使U盘更加迷你,外观更加精采.
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