Company Overview

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About the Company

[Summary] IC packaging and testing

Founded in 2006 in Shenzhen, the pioneering city of China's reform and opening-up, Qipai Technology is a national high-tech enterprise that focuses on the R&D and application of IC packaging and testing technologies, engaging in IC packaging and testing and providing packaging technology solutions. The company was listed on the STAR Market of the Shanghai Stock Exchange on June 23, 2021, with stock code 688216. In 2013, the company established a wholly-owned subsidiary, Guangdong Qipai Technology Co., Ltd., in Songshan Lake area of Dongguan, with a registered capital of 600 million yuan, covering an area of 100 mu, with a total planned building area of 220,000 square meters, and has completed 95,000 square meters of production plants and supporting facilities. It is recognized as a national high-tech enterprise, a "Little Giant" specialized and innovative enterprise by the Ministry of Industry and Information Technology, a pilot enterprise of Dongguan's "Doubling Plan" (having completed the three-year doubling goal and now an honorary doubling enterprise), and a high-growth small and medium-sized enterprise in Guangdong Province. Since its establishment, Qipai Technology has been engaged in IC packaging and testing services. After years of accumulation, the company has developed into one of the largest domestic IC packaging and testing enterprises in South China in terms of scale, and is one of the few technology-based application enterprises among domestic IC packaging and testing service providers with strong quality management systems and process innovation capabilities. According to the "China Semiconductor Packaging and Testing Industry Survey Report (2019 Edition)" by the China Semiconductor Industry Association, the company ranked 9th among domestic enterprises in revenue from IC packaging and testing business in 2018, and 2nd among domestic enterprises in South China. Since its inception, the company has adhered to independent innovation as the driving force for development, emphasizing the R&D and upgrading of IC packaging and testing technologies, and building market competitive advantages through product iteration and updates. The company has mastered core technologies such as 5G MIMO base station GaN microwave RF power amplifier plastic packaging technology, high-density large-matrix IC packaging technology, and miniaturized leaded self-designed packaging solutions, forming its competitive edge in the field of IC packaging and possessing strong competitiveness in the IC packaging and testing sector. The company is always committed to providing customers with more competitive packaging and testing products. Through continuous R&D investment and deep understanding of packaging forms such as DIP, SOP, SOT, and DFN/QFN, it has re-analyzed these packaging forms. The company independently defined new packaging forms, the Qipai and CPC series, which significantly reduce the size of products using traditional packaging forms like DIP, SOP, and SOT, ensuring product performance while substantially lowering packaging and testing costs. In addition, the company independently defined the new CDFN/CQFN series packaging forms. Compared to DFN/QFN series products, the company's self-defined CDFN/CQFN series products are easier to solder, reducing production costs while improving product yield. The company was recognized as a "National Encouraged IC Enterprise" by the National Development and Reform Commission, the Ministry of Industry and Information Technology, the General Administration of Customs, and the State Administration of Taxation in 2011 and 2013, and was rated as "China's Semiconductor Packaging Enterprise with the Most Development Potential" and "China's Semiconductor Packaging and Testing Enterprise with the Most Development Potential" by the China Semiconductor Packaging and Testing Industry Exchange Meeting in 2017 and 2018, respectively. The company's wholly-owned subsidiary, Guangdong Qipai, passed the accreditation of "Guangdong Provincial Qipai Integrated Circuit Packaging and Testing Engineering Technology Research Center" by the Guangdong Provincial Department of Science and Technology in September 2017, was recognized as a specialized and innovative "Little Giant" enterprise by the Ministry of Industry and Information Technology in December 2020, and in 2021, was included in the public list of recommended national specialized and innovative "Little Giant" enterprises. In December 2019, the company's self-defined "CPC packaging technology product" was recognized as a 2019 Guangdong Provincial High-tech Product by the Guangdong Provincial High-tech Enterprise Association and also rated as the "14th (2019) China Semiconductor Innovation Product and Technology" by the China Semiconductor Industry Association. In April 2020, Guangdong Qipai passed the accreditation of "Dongguan Integrated Circuit Packaging and Testing Engineering Technology Research Center" by the Dongguan Science and Technology Bureau. As of June 2021, the company holds 191 domestic and international patents, including 7 domestic invention patents and 3 overseas invention patents. The core technologies owned by the company are primarily based on independent innovation, are at an advanced level in the industry, and have been fully applied to all major products, achieving deep integration of scientific and technological achievements with industry. Qipai Technology adheres to the people-oriented philosophy, continuously improving employee incentive systems and competition mechanisms, refining management methods, mobilizing employee enthusiasm, tapping potential, and optimizing the human resource structure through multi-channel selection, graded assessment, competitive appointment, and job rotation, providing employees with platforms to fully realize their value. In recent years, the company has actively broadened talent introduction channels, extensively carried out industry-university-research cooperation, established diversified technology cooperation platforms, and attracted a large number of outstanding domestic and international professional technical and management talents. It has also successively carried out industry-university-research cooperation with top universities such as the University of Electronic Science and Technology of China and Xidian University, achieving remarkable results in solving key technical problems and cultivating senior technical talents for the enterprise. Gathering the momentum, leading with style! Qipai Technology aims to change lives through technology and improve human quality of life with technology and products, adhering to mutual benefit and win-win, being customer-oriented and creating value for customers; practicing people-oriented principles, contributing to society, customers, shareholders, and employees; upholding development and innovation, staying true to the original aspiration, and promoting development through industry; and promoting the enterprise spirit of "rigorous, efficient, innovative, and developing", continuously striving to build Qipai Technology into a "world-class packaging and testing service provider."

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Qipai Technology Financing History (1 rounds)

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IPO上市
Capital Market Favor
Latest Financing Round
  • Date: ?
  • Market:
  • Deal: 上交所

Qipai Technology How Fast Is Hiring Growing? (54 open positions)

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Growth Rate
2026 vs 2025
  • 2025: Down 49%
  • 2024: Down 6%
  • 2023: Down 23%
  • 2022: Down 7%
Qipai Technology Year-by-Year Hiring:
* Hiring was generally low during 2020-2022 due to the pandemic
Qipai Technology Campus Recruitment & Advanced Degree Talent Demand
Master's 2
Note: How fast is hiring at Qipai Technology Joint-stock Co., Ltd. growing? Qipai Technology2025: 50 openings (down 49%), 2024: 99 openings (down 6%), 2023: 105 openings (down 23%), 2022: 137 openings (down 7%), 2021: 147 openings. A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

Qipai Technology Master's Degree Job Demand Analysis

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Growth Rate
2026 vs 2025
  • 2025: Down 75%
  • 2024: Up 100%
  • 2023: Down 60%
  • 2022: Up 400%
Qipai Technology Master's Hiring by Year:
* Hiring was generally low during 2020-2022 due to the pandemic
How fast is master's hiring at Qipai Technology Joint-stock Co., Ltd. growing? Qipai TechnologyMaster's recruitment over the years: 2025: 1 openings (down 75%), 2024: 4 openings (up 100%), 2023: 2 openings (down 60%), 2022: 5 openings (up 400%), 2021: 1 openings.

Qipai Technology R&D Strength (Technical Talent Demand)

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How is the demand for technical talent at Qipai Technology Joint-stock Co., Ltd.? Based on an analysis of Qipai Technology's job postings over the past year, "其他(研发和技术类)" demand: 11.8%, "电子/电器/通信技术类": 9.1%, "计算机/网络/技术类": 9.1%, "机械/仪器仪表类": 8.2%, "生物/制药/化工/环保类": 4.5%, "电气/能源/动力类": 0.9%. For reference only.

Qipai Technology — What Are the Salaries Like? (110 records)

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Qipai Technology Salary Overview
salary range: 4.5K - 50K, 71.8% of roles pay ¥8-15K
Note: salary statistics are based on 110 salary records from the past year and depend on the job sample. For reference only.
How is the salary at Qipai Technology Joint-stock Co., Ltd.?Qipai Technology71.8% of positions earn 8-15K, Undergraduate salary: ¥。技工类 average salary ¥13.9K。 Note: Based on analysis of job postings, does not represent current on-the-job positions; system stability may affect objectivity. For reference only.Data inaccurate? Let us know

Salaries for hot jobs of Qipai Technology

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Are salaries high at Qipai Technology Joint-stock Co., Ltd.? We provide: 工艺工程,设备工,程序开发,销售,电镀,行政,pd,qe,体系工程师,设备技术,ce工程师,副总,品质工程,大客户,客服,工艺总监,开发工程师,操作工,核算,法务. Click to view detailed salary analysis by job.

Qipai Technology Related Industry Tags

Tags are auto-annotated by keyword text matching and may be correlated. For reference only.

Job Category

  • 技工类
    24.3% of total 24.3%
  • 工厂生产类
    23.4% of total 23.4%
  • 质量管理类
    13.5% of total 13.5%
  • 其他(研发和技术类)
    11.7% of total 11.7%

Education

  • 本科
    50.5% of total 50.5%
  • 大专
    43.2% of total 43.2%
  • 不限
    2.7% of total 2.7%
  • 高中
    1.8% of total 1.8%

Experience

  • 不限
    83.8% of total 83.8%
  • 3-5年
    11.7% of total 11.7%
  • 1-3年
    3.6% of total 3.6%
  • 5-10年
    0.9% of total 0.9%
View Detailed Analysis

What does Qipai Technology Joint-stock Co., Ltd. require? Who is Qipai Technology hiring? Qipai Technology recruitment: 技工类占比最多占24.3%,其次是工厂生产类占23.4%. What education can get in at Qipai Technology? 本科占比最多占50.5%,其次是大专占43.2%. High education required at Qipai Technology? 硕士占1.8%. Work experience required at Qipai Technology? 不限占比最多占83.8%,其次是3-5年占11.7%. Where are the job locations at Qipai Technology? 东莞占比最多占94.6%,其次是惠州占5.4%. Based on job postings from the past year, for reference only.

Business Registration

Provided by

Operating Status: 开业
Registered Capital: 10,687.9805万(元)
Legal Representative: 梁大钟
Date Established:
Credit Code: 914403007954196722
Registered Address: 深圳市龙岗区平湖街道辅城坳社区平龙西路250号1#厂房301-2

Partners & Suppliers

采购华海诚科的环氧塑封料用于半导体封装 Source
供应商 封装测试
与气派科技在集成电路封装领域开展产学研合作 Source
供应商 高校/研究院合作
采购联动科技的半导体分立器件测试系统、封装测试分选机等设备 Source
供应商 半导体封装测试
半导体封装测试设备 Source
供应商 半导体封装设备
采购金海通的测试分选机、测试座等产品 Source
供应商 集成电路封测

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