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About the Company

2012年仕通科技积极进入中国微电子半导体设备及仓储设备市场,引进中国电子科技集团公司第二研究所先进的技术和专用设备。在成都、重庆、西安、贵阳均建立销售及服务中心,满足客户需求,已与知名企业及单位建立长期合作关系。我司产品主要分为四部分:1、微电子封装设备;2、LTCC/HTCC陶瓷产线工艺设备;3、智能仓储物流设备;4、车间辅助工位器具装备;我们始终以客户的需求为导向,以帮助客户提高效率,降低成本,创造价值为目的,本着安全高效和人性化宗旨,依靠专业的团队,开发了芯片贴合设备系列、引线键合设备系列、气密性封装设备系列、等离子清洗系列、LTCC/HTCC陶瓷产线工艺设备系列、智能仓储物流设备系列及车间辅助工位器具装备系列等多系列的产品,广泛用于微波、通讯、航空、航天、汽车电子等各个行业领域,为大量现代化企业的生产和管理提供的优质的产品和服务。遵循诚信、品质、服务的原则,坚持为客户提供高品质产品、专业服务以及良好的售后服务,注重于客户建立长期互信、合作双赢的伙伴关系,为客户创造价值!企业方针:信誉是灵魂,品质是生命。公司坚持以高质量、综合性价比赢得客户和市场,专业的售后服务增强企业的市场竞争力!我们的目标:成为国内顶尖的专业设备供应商。成为业界的*并持续发展。

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Recruitment Overview / Current Status (2 open positions)

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Note: How fast is hiring at 成都仕通科技有限公司 growing? . A rising curve may indicate expansion; a falling curve may indicate slower growth or good retention. Based on publicly available data, for reference only.

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Business Registration

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Operating Status: 开业
Registered Capital: 1,200万(元)
Legal Representative: 杨弯
Date Established:
Credit Code: 91510107054915476A
Registered Address: 成都市武侯区武侯电商产业功能区管委会武青南路33号孵化楼5层507号

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